Tamper-evident/tamper-resistant electronic components
AssigneeHewlett-Packard Development Company, L.P.
InventorsGary Schwenck, Mark Corio, Keith Alexander Harrison
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AssigneeHewlett-Packard Development Company, L.P.
InventorsGary Schwenck, Mark Corio, Keith Alexander Harrison
Estimating the term…
A tamper evident electronic module comprises an electronic component, a tamper evident sheet, and encapsulant material. Said component is encapsulated in the encapsulant material and the sheet overlies the component, and the sheet comprises a flexible multi-layer sheet, a plurality of the layers of the sheet being selected from the group below: (i) an electromagnetic radiation shield layer; (ii) a tell-tale electrically conductive trip wire defining a convoluted meandering pathway on the layer, the trip wire meandering in a pattern which substantially covers the electronic component in a space filled area if the layer; (iii) a layer having the features of (ii), and in which the pathway comprises a fractual pattern; (iv) a layer having the features of (ii), and in which a second tell-tale trip wire extends alongside a first tell-tale trip wire so that they meander as a spaced pair. (v) an active electromagnetic marking layer adapted to emitt electromagnetic radiation.
A tamper-evident and/or tamper-resistant electronic module comprising an electronic component, a tamper-evident and/or tamper-resistant sheet, and encapsulant material, said component being encapsulated in said encapsulant material, said sheet overlying said component, said sheet comprising a multi-layer sheet, said tamper-evident and/or tamper-resistant sheet being encapsulated in said encapsulant material, and said encapsulant material being opaque so that said tamper-evident and/or tamper-resistant sheet cannot be seen, a plurality of said layers of said sheet being selected from the groups:
A tamper-evident and/or tamper-resistant electronic module comprising an electronic component, a tamper-evident and/or tamper-resistant sheet, and encapsulant material, wherein said component is encapsulated in said encapsulant material and said sheet overlies said component, and wherein said sheet comprises a multi-layer sheet, a plurality of said layers of said sheet being selected from the groups:
Dependencies are inferred from the claim text.