Conveyor system
AssigneeShinko Electric Industries Co., Ltd.
InventorAkihiro Miyamoto
Life of this patent
Estimating the term…
Abstract
A conveyor system able to safety convey a workpiece having a thickness of less than 100 μm and easily position the workpiece, provided with a plate-shaped member provided movably and swivelably and a moving and swiveling means moving and swiveling the plate-shaped member, the plate-shaped member being provided together with a lifting means for uniformly lifting in its entirety a workpiece carried at the carrying location and a holding means for holding a workpiece lifted by the lifting means by chucking its entirety on a workpiece chucking surface of the plate-shaped member, and a plurality of Verneuil nozzles serving as the lifting means and a plurality of vacuum chucking nozzles serving as the holding means being formed in the workpiece chucking surface near an outer periphery of the plate-shaped member along the outer periphery.
Claims8
A conveyor system for conveying a wafer or other thin workpiece having a thickness of not more than 100 μm from its carrying location to another location, comprising:
- a plate-shaped member provided movably and swivelably and a moving;
- swiveling means for moving and swiveling said plate-shaped member;
- said plate-shaped member being provided together with a lifting means for uniformly lifting in its entirety a workpiece carried at said carrying location and a holding means for holding a workpiece lifted by said lifting means, by uniformly chucking its entirety on a workpiece chucking surface of said plate-shaped member;
- said holding means being comprised of a plurality of vacuum chucking nozzles;
- a plurality of Bernoulli nozzles serving as said lifting means formed in the workpiece chucking surface near an outer periphery of said plate-shaped member along said outer periphery;
- and
- said plurality of Bernoulli nozzles and said plurality of vacuum chucking nozzles being alternately formed on the workpiece chucking surface near the outer periphery of said plate-shaped member along said outer periphery.
A conveyor system for conveying a wafer or other thin workpiece having a thickness of not more than 100 μm from its carrying location to another location, comprising:
- a plate-shaped member provided movably and swivelably;
- moving and swiveling means for moving and swiveling said plate-shaped member;
- said plate-shaped member being provided together with a lifting means for uniformly lifting in its entirety a workpiece carried at said carrying location and a holding means for holding a workpiece lifted by said lifting means, by uniformly chucking its entirety on a workpiece chucking surface of said plate-shaped member;
- said holding means being comprised of at least one electrostatic chucking plate;
- said electrostatic chucking plate being provided at the workpiece chucking surface of said plate-shaped member;
- a plurality of Bernoulli nozzles serving as said lifting means formed in the workpiece chucking surface near an outer periphery of said plate-shaped member along said outer periphery;
- a controller to control drive timings of said lifting means and said holding means;
- and
- a detachment prevention member to prevent part of the workpiece lifted by the plurality of Bernoulli nozzles from being detached from said plate-shaped member, provided at the outer periphery of the plate-shaped member, and biased by an elastic member in a direction where its front end projects out from the workpiece chucking surface of the plate-shaped member.
Dependencies are inferred from the claim text.