Heat dissipation device having cap for protecting thermal interface material thereon
AssigneeHon Hai Precision Industry Co., Ltd.
InventorsFang-Xiang Yu, Meng-Tzu Lee, Shu-Ho Lin
Life of this patent
Estimating the term…
Abstract
A heat dissipation device includes a heat sink (10), thermal interface material (30) spread on a bottom surface (16) of the heat sink, two legs (22) of a clip (20) disposed at opposite sides of the heat sink, and a protective cap (40) enclosing the thermal interface material therein. The protective cap includes ears (48) interlocked with the legs of the clip to retain the protective cap to the heat sink. The legs of the clip are also used for interlocking with engaging member (52) on a printed circuit board (50) thereby firmly mounting the heat sink to a CPU (54) on the printed circuit board.
Claims18
A protective cap for thermal interface material spread on a heat sink, the protective cap comprising:
- a basewall defining a cavity for enclosing the thermal interface material therein;
- sidewalls extending from periphery of the basewall;
- and
- a locking portion comprising a pair of ears extending outwardly from opposite sidewalls, a pair of hooks being formed at free ends of the ears, respectively, the locking portion being adapted for locking with a clip for retaining the protective cap to the heat sink.
A heat dissipation device, comprising:
- a heat sink comprising a base;
- thermal interface material spread on a bottom of the base;
- two locking legs disposed at opposite sides of the heat sink;
- and
- a protective cap enclosing the thermal interface material therein, and comprising locking portions interlocked with the locking legs for retaining the protective cap to the heat sink.
A heat dissipation device comprising:
- a heat sink having a bottom surface and a plurality of fins extending upwardly, top ends of the fins cooperatively forming a top side of the heat sink;
- thermal interface material on the bottom surface of the heat sink;
- a clip attached to the top side of the heat sink for mounting the heat sink to a heat-generating electronic component;
- and
- a protective cap covering the thermal interface material to prevent contamination thereof, the protection cap having a portion engaging with the clip thereby attaching the protection cap to the heat sink.
Dependencies are inferred from the claim text.