Method and apparatus for chip-cooling
AssigneeInternational Business Machines Corporation
InventorsJeffrey D. Gelorme, Hendrik F. Hamann, Nancy C. LaBianca, Yves C. Martin, Theodore G. Van Kessel
Life of this patent
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Abstract
A thermal interface for IC chip cooling is provided. One embodiment of the thermal interface includes a thermally conductive liquid or paste-like metal(s) disposed within a flexible, thermally conductive enclosure. The enclosure is adapted to be placed between an IC chip and a heat sink to enhance heat transfer from the chip to the heat sink, thereby enabling quicker and more efficient cooling of the chip than can be achieved by conventional techniques. In several embodiments, the thermal interface is held in place by mechanical pressure rather than by bonding, which further facilitates inspection and repair of the IC device.
Claims27
A thermal interface comprising:
- a thermally conductive fluid;
- a flexible enclosure for confining the thermally conductive fluid;
- and
- at least one containment pad surrounding a perimeter edge of the enclosure.
An integrated circuit device comprising:
- at least one heat source;
- at least one heat sink positioned in proximity to the at least one heat source;
- and
- at least one thermal interface positioned between the at least one heat source and the at least one heat sink, the thermal interface comprising:
- a thermally conductive fluid;
- an enclosure for confining the thermally conductive fluid, wherein at least one surface of the enclosure is flexible and the enclosure is in thermal contact with both the at least one heat source and the at least one heat sink;
- and
- at least one flexible gasket sealing a perimeter around the at least one heat source and the at least one heat sink.
An integrated circuit device comprising:
- at least one heat source;
- at least one heat sink positioned in proximity to the at least one heat source;
- and
- at least one thermal interface positioned between the at least one heat source and the at least one heat sink, the thermal interface comprising:
- a thermally conductive fluid retained between the at least one heat source and the at least one heat sink;
- and
- at least one flexible gasket sealing a perimeter around the at least one heat source and the at least one heat sink, for retaining the fluid therebetween.
Method for facilitating heat transfer from a heat source to a heat sink, the method comprising the steps of:
- providing a thermally conductive fluid between the heat source and the heat sink, said thermally conductive fluid being in thermal contact with both the heat source and the heat sink;
- and
- enclosing the thermally conductive fluid in a thermally conductive enclosure, wherein at least a portion of the enclosure is flexible, and wherein the step of enclosing the thermally conductive fluid comprises enclosing the fluid in a cavity formed between the heat source and the heat sink, the cavity being sealed around a perimeter by a flexible gasket.
Method for assembling a multi-chip integrated circuit device comprising the steps of:
- assembling two or more integrated circuit chips on a substrate;
- placing a thermal interface in contact with each of the two or more integrated circuit chips, the thermal interface comprising:
- a thermally conductive fluid;
- a flexible enclosure for confining the thermally conductive fluid;
- and
- at least one containment pad surrounding a perimeter edge of the enclosure;
- and
- placing a heat sink in thermal contact each of the two or more integrated circuit chips.
An integrated circuit device comprising:
- at least one heat source;
- at least one heat sink positioned in proximity to the at least one heat source;
- and
- at least one thermal interface positioned between the at least one heat source and the at least one heat sink, the thermal interface comprising:
- a thermally conductive fluid;
- an enclosure for confining the thermally conductive fluid, wherein at least one surface of the enclosure is flexible and the enclosure is in thermal contact with both the at least one heat source and the at least one heat sink;
- and
- at feast one containment pad surrounding a perimeter edge of the enclosure.
Dependencies are inferred from the claim text.