Method for producing electroconductive particles
AssigneeSekisui Chemical Co., Ltd.
InventorsYoshiaki Tanaka, Nobuyuki Okinaga, Manabu Matsubara
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AssigneeSekisui Chemical Co., Ltd.
InventorsYoshiaki Tanaka, Nobuyuki Okinaga, Manabu Matsubara
Estimating the term…
The purpose of the invention is to provide a method for producing conductive fine particles having a plating layer of extremely uniform thickness and free from scratches without being accompanied with agglomeration of fine particles to be plated during the plating process and a method for producing conductive fine particles comprising resin fine particles and a tin/silver alloy plating layer formed thereon. The invention is a method for producing a conductive fine particle, which comprises forming a plating layer on the surface of a fine particle to be plated using a barrel plating apparatus having a rotatable barrel in a plating bath, said method comprising putting the fine particle to be plated and a dummy particle with a lager particle diameter than that of the fine particle to be plated in the barrel and forming a plating layer while vibrating the barrel at an amplitude of 0.05 to 3.0 mm and a frequency of 20 to 120 Hz.
A method for producing a conductive fine particle,
Dependencies are inferred from the claim text.