Plasma processing apparatus, and electrode structure and table structure of processing apparatus

A placement table structure used for a processing apparatus performing a predetermined process on an object to be processed in a process chamber in which a vacuum can be formed, the placement table structure comprising:

• a placement table having a heater unit therein so as to heat said object to be processed;
• a cooling block joined to the placement table and having a cooling jacket which cools said placement table;
• a labyrinth heat transfer space formed by complementary concentric or spiral grooves provided on opposite surfaces of said placement table and said cooling block;
• and
• a heat transfer gas supply structure configured to supply a heat transfer gas to said labyrinth heat transfer space.

An electrode structure used in a plasma processing apparatus which performs a predetermined process on an object to be processed by using a plasma in a process chamber in which a vacuum can be formed, the electrode structure comprising:

• an electrode unit having a heater unit therein;
• a cooling block joined to the electrode unit and having a cooling jacket which cools said electrode unit;
• a labyrinth heat transfer space formed by complementary concentric or spiral grooves provided on opposite surfaces of said electrode unit and said cooling block;
• an electrode-side heat transfer gas supply structure configured to supply a heat transfer gas to said labyrinth heat transfer space;
• and
• an aluminum nitride (AlN) thermally insulating member provided between said electrode unit and said cooling block, the heat transfer space being divided into an upper space and a lower space by the thermally insulating member, said thermally insulating member having a coefficient of thermal conductivity of more than 80 W/mK at a process temperature of said object to be processed.

An electrode structure used in a plasma processing apparatus which performs a predetermined process on an object to be processed by using a plasma in a process chamber in which a vacuum can be formed, the electrode structure, comprising:

• an electrode unit having a heater unit therein;
• a cooling block joined to the electrode unit and having a cooling jacket which cools said electrode unit;
• a labyrinth heat transfer space formed by complementary concentric or spiral grooves provided on opposite surfaces of said electrode unit and said cooling block;
• and
• an electrode-side heat transfer gas supply structure configured to supply a heat transfer gas to said labyrinth heat transfer space, wherein a contact rate of a joining surface of a member, which is joined to define said heat transfer space, is set to fall within a range from 40% to 80%.

An electrode structure used in a plasma processing apparatus which performs a predetermined process on an object to be processed by using a plasma in a process chamber in which a vacuum can be formed, the electrode structure comprising:

• an electrode unit having a heater unit therein;
• a cooling block joined to the electrode unit and having a cooling jacket which cools said electrode unit;
• a labyrinth heat transfer space formed by a complementary concentric or spiral grooves provided on opposite surfaces of said electrode unit and said cooling block;
• and
• an electrode-side heat transfer gas supply structure configured to supply a heat transfer gas to said labyrinth heat transfer space, wherein said heater unit is divided into concentric zones, and the divided zones are controllable on an individual basis.

An electrode structure used in a plasma processing apparatus which performs a predetermined process on an object to be processed by using a plasma in a process chamber in which a vacuum can be formed, the electrode structure comprising:

• an electrode unit having a heater unit therein;
• a cooling block joined to the electrode unit and having a cooling jacket which cools said electrode unit;
• a labyrinth heat transfer space formed by complementary concentric or spiral grooves provided on opposite surfaces of said electrode unit and said cooling block;
• and
• an electrode-side heat transfer gas supply structure configured to supply a heat transfer gas to said labyrinth heat transfer space,
• wherein said electrode unit is a lower electrode unit which also serves as a placement table on which said object to be processed is placed, and the electrode structure further comprises an electrostatic chuck which is joined to an upper surface of the lower electrode unit so as to attract said object to be processed and a chuck-side heat transfer gas supply structure configured to supply a heat transfer gas to a chuck-side heat transfer space formed between said electrostatic chuck and said object to be processed.

An electrode structure used in a plasma processing apparatus which performs a predetermined process on an object to be processed by using a plasma in a process chamber in which a vacuum can be formed, the electrode structure comprising:

• an electrode unit having a heater unit therein;
• a cooling block joined to the electrode unit and having a cooling jacket which cools said electrode unit;
• a labyrinth heat transfer space formed by complementary concentric or spiral grooves provided on opposite surfaces of said electrode unit and said cooling block;
• and
• an electrode-side heat transfer gas supply structure configured to supply a heat transfer gas to said labyrinth heat transfer space,
• wherein the center of said electrode unit is held by a hollow column, and a gas blower is provided in said column for promoting a release of heat by blowing a gas toward the center of a back surface of said electrode unit.

A placement table structure used for a processing apparatus performing a predetermined process on an object to be processed in a process chamber in which a vacuum can be formed, the placement table structure comprising:

• a placement table having a heater unit therein so as to heat said object to be processed;
• a cooling block joined to the placement table and having a cooling jacket which cools said placement table;
• a labyrinth heat transfer space formed by a complementary concentric or spiral grooves provided on opposite surfaces of said placement table and said cooling block;
• and
• a heat transfer gas supply structure configured to supple a heat transfer gas to said labyrinth heat transfer space,
• wherein a rate of contact of a joining surface of a member joined to define said heat transfer space is set to fall within a range from 40% to 80%.

A placement table structure used for a processing apparatus performing a predetermined process on an object to be processed in a process chamber in which a vacuum can be formed, the placement table structure comprising:

• a placement table having a heater unit therein so as to heat said object to be processed;
• a cooling block joined to the placement table and having a cooling jacket which cools said placement table;
• a labyrinth heat transfer space formed by complementary concentric or spiral grooves provided on opposite surfaces of said placement table and said cooling block;
• and
• a heat transfer gas supply structure configured to supply a heat transfer gas to said labyrinth heat transfer space,
• wherein the center of said placement table is held by a hollow column, and a gas blower is provided in said column for promoting a release of heat by blowing a gas toward the center of a back surface of said electrode unit.