Method and system for a reject management protocol within a back-end integrated circuit manufacturing process

A method of reject management within a back-end IC manufacturing process comprising:

• automatically traversing a die-strip through a plurality of integrated sub-stations of said back-end manufacturing process, wherein said traversing is performed in an in-line fashion through said sub-stations and wherein further said die-strip comprises a plurality of individual die;
• and
• automatically inspecting said die-strip at some of said sub-stations using vision camera systems;
• and
• automatically updating a memory stored database with results obtained from said inspecting, said database storing information for each die of said die-strip.

A system for reject management within a back-end IC manufacturing process comprising:

• a plurality of integrated sub-stations performing back-end manufacturing processes on a die-strip traversing therethrough;
• a plurality of vision camera systems deployed within some of said plurality of integrated sub-stations for automatically identifying a code associated with said die-strip to determine a location of said die-strip and also for automatically examining a plurality of die on said die-strip for physical attributes thereof;
• and
• a computer system coupled to said vision camera systems and comprising a memory for integrating results of said vision camera systems for each die of said die-strip into a database.

A system for reject management within a back-end IC manufacturing process comprising:

• a plurality of integrated sub-stations performing back-end manufacturing processes on a plurality of die-strips traversing therethrough in an in-line fashion;
• a plurality of vision camera systems deployed within some of said plurality of integrated sub-stations for automatically identifying a respective code associated with each die-strip to determine a location of each die-strip and also for automatically examining a plurality of die on said die-strip for physical attributes thereof;
• a tester sub-station for performing electronic testing of said plurality of die of said die-strip;
• and
• a computer system coupled to said vision camera systems and coupled to said tester sub-station and comprising a memory for integrating results of said plurality of vision camera systems and said tester sub-station for each die of said die-strip into a database.