Heat pipe cooled electronics enclosure

An enclosure for electronic components comprising:

• an electronics housing including a plurality of slots each of which is configured to receive one or more electronic components, each of the slots being defined by a plurality of slot walls;
• and
• a respective heat pipe system associated with each slot for dissipating heat produced by the one or more electronic components housed therein, each of the heat pipe systems including:
• a plurality of heat pipes each having a first portion embedded into one of the slot walls for conducting heat from the wall to a second portion of the heat pipe extending out of the electronics housing;
• and
• the second portion of each heat pipe being connected to a cooling fin such that heat from the heat pipe is conducted into the fin and the fin dissipates the heat to the ambient atmosphere outside of the electronics housing.

A repeater enclosure for a plurality of repeater cards comprising:

• a card housing including a plurality of slots each of which is configured to receive one or more repeater cards, each of the slots being defined by a plurality of slot walls;
• a respective heat pipe system associated with each slot for dissipating heat produced by the one or more repeater cards housed therein, each of the heat pipe systems including:
• a plurality of heat pipes each having a first portion embedded into one of the slot walls for conducting heat from the wall to a second portion of the heat pipe extending out of the electronics housing;
• and
• the second portion of each heat pipe being connected to a plurality of cooling fin such that heat from the heat pipe is conducted into the fin and the fin dissipates the heat to the ambient atmosphere outside of the electronics housing;
• and
• a protective cover surrounding the plurality of cooling fins, the protective cover being ventilated to permit the flow of ambient air therethrough.