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US 7,030,485 B2Granted
Thermal interface structure with integrated liquid cooling and methods
AssigneeIntel Corporation
InventorsSabina J. Houle, James Christopher Matayabas, Jr.
Life of this patent
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Abstract
A method and device for thermal conduction is provided. A thermal interface device and method of formation is described that includes advantages such as improved interfacial strength, and improved interfacial contact. Embodiments of thermal conduction structures are shown that provide composite thermal conduction and circulated liquid cooling. Embodiments are further shown that require simple, low numbers of manufacturing steps and reduced thermal interface thickness.
Claims9
An integrated circuit chip assembly, comprising:
- an integrated circuit chip;
- a heat spreader;
- a thermal interface structure, including a perimeter seal portion, the seal portion coupled between the heat spreader and at least a portion of a surface of the integrated circuit chip;
- and
- wherein at least one interface of the perimeter seal portion includes cold formed features.
2 more elements
Dependencies are inferred from the claim text.