Lidless chip package effectively having co-planar frame and semiconductor die surfaces
AssigneeSun Microsystems, Inc.
InventorsWen-Chun Zheng, Henry Jung
Life of this patent
Estimating the term…
Abstract
A “lidless” integrated circuit package includes a support member that is arranged to support at least part of a load placed on the integrated circuit package. The support member has or is connected to a flexible support device that is in supportive contact with the load and that is designed to flex dependent on a position of the support member. The flexible support device substantially ensures that a plane of the surface of the flexible support device and a plane of a surface of a semiconductor die of the integrated circuit package are co-planar, thereby leading to a desirable load distribution within the integrated circuit package.
Claims18
An apparatus, comprising:
- a substrate;
- a semiconductor die disposed on the substrate and having an integrated circuit electrically connected to the substrate;
- a load source, at least part of which is disposed over and in operative contact with semiconductor die;
- a support member disposed on the substrate;
- and
- a flexible support device connected to the support member and in operative contact with the load source,
- wherein the flexible support device is partially embedded within the support member.
An apparatus, comprising:
- a substrate;
- a semiconductor die disposed on the substrate and having an integrated circuit electrically connected to the substrate;
- a load source, at least part of which is disposed over and in operative contact with semiconductor die;
- a support member disposed on the substrate;
- and
- a flexible support device connected to the support member and in operative contact with the load source,
- wherein the support member is a stiffener.
An apparatus, comprising:
- a substrate;
- a semiconductor die disposed on the substrate and having an integrated circuit electrically connected to the substrate;
- a load source, at least part of which is disposed over and in operative contact with semiconductor die;
- a support member disposed on the substrate;
- and
- a flexible support device connected to the support member and in operative contact with the load source,
- wherein the support member peripherally encloses the semiconductor die.
An apparatus, comprising:
- a substrate;
- a semiconductor die disposed on the substrate and having an integrated circuit electrically connected to the substrate;
- a load source, at least part of which is disposed over and in operative contact with semiconductor die;
- a support member disposed on the substrate;
- a flexible support device connected to the support member and in operative contact with the load source, and
- an adhesive disposed between the substrate and the support member.
A computer system, comprising:
- a circuit board;
- a substrate electrically connected to the circuit board, the substrate having electrically conductive paths arranged to pass signals between the circuit board and an integrated circuit;
- a semiconductor die disposed on the substrate and having the integrated circuit fabricated thereon, wherein a load source is disposed over the semiconductor die;
- and
- a support member attached to the substrate and connected to a flexible support device in supportive contact with the load source,
- wherein the flexible support device is partially embedded in the support member.
An integrated circuit package, comprising:
- means for processing data;
- means for housing at least a portion of the means for processing;
- means for supporting the means for housing;
- support means for bearing at least part of a load placed on the integrated circuit package;
- and
- flexible means connected to the support means for supporting the at least part of the load,
- wherein a state of the flexible means is dependent on a position of the support means, and
- wherein the flexible means is at least partially embedded in the support means.
Dependencies are inferred from the claim text.