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US 7,023,701 B2Granted
Device for cooling memory modules
AssigneeInfineon Technologies AG
InventorsChristian Stocken, Stephan Schröder, Thomas Huber, Manfred Pröll
Life of this patent
Estimating the term…
Abstract
A device for cooling memory modules can include a plurality of elements. The elements can thermal couple at least two memory modules. The device can further include a body or a plurality of contact areas bearing in a planar manner.
Claims7
A device for cooling memory modules comprising:
- a body comprising a comb-shaped configuration in longitudinal section and including a plurality of elements, the elements thermally coupling at least two memory modules, wherein at least two adjacently aligned elements include surfaces that face each other, each surface including a contact element extending from and connected to the surface via a spring element that biases the contact element away from the surface, such that the contact elements extend toward and engage with a memory module that is placed between the adjacently aligned elements.
Dependencies are inferred from the claim text.