Liquid cooled metal thermal stack for high-power dies

A system for transferring heat energy in an electronic assembly, the system comprising:

• an electrical component;
• a first elastically deformable member in thermal communication with the electrical component and having a compressed position that fixes the first elastically deformable member in an assembled location;
• and
• wherein the first elastically deformable member includes a plurality of projections increasing the surface area to improve dissipation of heat energy.

A system for transferring heat energy in an electronic assembly, the system comprising:

• an electrical component;
• a first elastically deformable member in thermal communication with the electrical component and having a compressed position that fixes the first elastically deformable member in an assembled location;
• a housing for protecting the electronic assembly, the first elastically deformable member being in thermal communication with the housing;
• and
• wherein the housing includes a metal pad, the first elastically deformable member being soldered to the metal pad.

A system for transferring heat energy in an electronic assembly, the system comprising:

• an electrical component;
• a first elastically deformable member in thermal communication with the electrical component and having a compressed position that fixes the first elastically deformable member in an assembled location;
• a housing for protecting the electronic assembly, the first elastically deformable member being in thermal communication with the housing, wherein the housing includes a recess for receiving the first elastically deformable member;
• and
• wherein the first elastically deformable member includes at least one elastically deformable member for fixing the first elastically deformable member in the recess of the housing.

A system for transferring heat energy in an electronic assembly, the system comprising:

• an electrical component;
• a first elastically deformable member in thermal communication with the electrical component and having a compressed position that fixes the first elastically deformable member in an assembled location;
• a printed circuit board in thermal communication with the electrical component;
• a counter support to relieve mechanical stress caused by the first elastically deformable member;
• and
• a housing for protecting the electronic assembly, the first elastically deformable member being in thermal communication with the housing.