Air-gap insulator for short-term exposure to a high temperature environment

A packaging system for electronic circuitry, wherein the electronic circuitry is disposed on a substrate, the packaging system comprising in combination:

• an inner housing surrounding the substrate;
• an outer housing surrounding the inner housing and the substrate;
• and
• a gap positioned between the inner and outer housings, the gap filled with insulating media, whereby when the packaging system experiences short term exposure to a high temperature, the combination of the inner housing, the outer housing, and the gap allow the electronic circuitry to maintain operability, and wherein the electronic circuitry comprises sensing electronics.

A packaging system for electronic circuitry, wherein the electronic circuitry is disposed on a substrate, the packaging system comprising in combination:

• an inner housing fabricated from material having low thermal conductivity, the inner housing defining a first cavity for accepting the substrate, the inner housing including an outer surface having at least one protrusion extending away from the outer surface;
• an outer housing defining a second cavity for accepting the inner housing and substrate, the second cavity including an inner surface for contacting the at least one protrusion extending from the outer surface of the inner housing;
• and
• a gap positioned between the outer surface of the inner housing and the inner surface of the outer housing, the gap filled with an insulating media, whereby when the packaging system experiences short term exposure to a high temperature, the combination of the inner housing, the outer housing, and the gap allow the electronic circuitry to maintain operability,
• wherein the inner housing is substantially cylindrical and has distal and proximate ends, the proximate end having an opening for the first cavity,
• wherein at least one protrusion from the outer surface of the inner housing defines (i) at least one first pedestal located on the distal end, (ii) a plurality of second pedestals located axially on the outer surface of the inner housing close to the distal end, and (iii) at least one ring located radially on the outer surface of the inner housing close to the proximate end,
• wherein the inner surface of the second cavity of the outer housing defines a cylindrical portion having distal and proximate ends, the proximate end having an opening for the second cavity, wherein when the inner housing is inserted in the outer housing, (i) at least one first pedestal contacts the distal end of the second cavity, (ii) the plurality of second pedestals contact the inner surface of the second cavity, and (iii) the at least one ring contacts the inner surface of the second cavity, and
• wherein the gap filled with insulating media defines a region between the outer surface of the inner housing and the inner surface of the outer housing when the inner housing is inserted in the outer housing.

A packaging system for electronic circuitry, wherein the electronic circuitry is disposed on a substrate, the packaging system comprising in combination:

• an inner housing fabricated from material having low thermal conductivity, the inner housing defining a first cavity for accepting the substrate, the inner housing including an outer surface having at least one protrusion extending away from the outer surface;
• an outer housing defining a second cavity for accepting the inner housing and substrate, the second cavity including an inner surface for contacting the at least one protrusion extending from the outer surface of the inner housing;
• a gap positioned between the outer surface of the inner housing and the inner surface of the outer housing, the gap filled with an insulating media;
• a second gap positioned between the first cavity and the substrate, the second gap filled with insulating media, and the second gap providing an additional insulating layer;
• and
• an electromagnetic interference shield positioned between the outer surface of the inner housing and the substrate, the electromagnetic interference shield surrounding at least a portion of the substrate, whereby when the packaging system experiences short term exposure to a high temperature, the combination of the inner housing, the outer housing, the electromagnetic interference shield, and the first and second gaps allow the electronic circuitry to maintain operability.

A packaging system for electronic circuitry, wherein the electronic circuitry is disposed on a substrate, the packaging system comprising in combination:

• an inner housing fabricated from material having low thermal conductivity, the inner housing defining a first cavity for accepting the substrate, the inner housing including an outer surface having at least one protrusion extending away from the outer surface;
• an outer housing defining a second cavity for accepting the inner housing and substrate, the second cavity including an inner surface for contacting the at least one protrusion extending from the outer surface of the inner housing;
• a gap positioned between the outer surface of the inner housing and the inner surface of the outer housing, the gap filled with an insulating media, whereby when the packaging system experiences short term exposure to a high temperature, the combination of the inner housing, the outer housing, and the gap allow the electronic circuitry to maintain operability;
• and
• an electromagnetic interference shield positioned between the outer surface of the inner housing and the substrate, the electromagnetic interference shield surrounding at least a portion of the substrate.