Back to results
US 7,023,087 B1Granted
Integrated circuit carrier and method of manufacturing and integrated circuit
AssigneeAgere Systems Inc.
InventorsMatthew Brett Baillie, Gary John Reichl
Life of this patent
Estimating the term…
Abstract
A process for manufacturing an integrated circuit including the steps of providing a chip carrier including a base, an inner well formed about the periphery of the base, and an outer well formed about the periphery of the inner well. An integrated circuit is positioned on the base. The process further includes the steps of pre or post processing the integrated circuit.
Claims16
A chip carrier comprising:
- a base having a surface and a periphery;
- an inner well having a periphery extending along the periphery of the base and wherein the inner well has a second base having a second depth between the second base and the surface;
- an outer well extending along the periphery of the inner well, and wherein the outer well has a first base having a first depth between the first base and the surface, wherein the first depth is greater than the second depth.
A chip carrier comprising:
- a base having a surface and a periphery;
- an inner well having a periphery extending along the periphery of the base and wherein the inner well has a second base having a second depth between the second base and the surface;
- an outer well extending along the periphery of the inner well, and wherein the outer well has a first base having a first depth between the first base and the surface, wherein the first depth is greater than the second depth;
- and
- the chip carrier adapted to temporarily hold an integrated circuit in the chip carrier.
2 more elements
Dependencies are inferred from the claim text.