Conditioning of a reaction chamber
AssigneeMicron Technology, Inc.
InventorsWilliam A. Polinsky, Bill Crane, John C. Gonzales, Steven Ott
Life of this patent
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Abstract
A method is provided for forming polymer on an interior surface of a reaction chamber. A polymer-forming gas is introduced into the chamber and the environment is regulated to form the polymer on the interior surface of the chamber. Methods for the manufacture of integrated circuits, electronic devices, and electronic systems, are also provided.
Claims32
A method for forming polymer within a reaction chamber, the process comprising:
- providing a reaction chamber;
- introducing a polymer-forming gas within the reaction chamber concurrent with etching of a photoresist layer of a first semiconductor wafer in the reaction chamber;
- and
- regulating an environment within the reaction chamber to form a polymer on an interior surface of the reaction chamber.
A method of manufacturing an integrated circuit, the method comprising the acts of:
- disposing a first semiconductor wafer having a plurality of layers in a reaction chamber;
- processing the first semiconductor wafer in the reaction chamber, the processing including etching a photoresist layer of the first semiconductor wafer;
- and
- reducing the standard deviation of the critical dimensions of the first semiconductor wafer by providing a polymer-building gas in the reaction chamber during the etching of the photoresist layer of the first semiconductor wafer to create a layer of polymer on an interior portion of the reaction chamber.
A method of manufacturing an electronic device, the method comprising:
- providing an integrated circuit manufactured by a process comprising:
- disposing a first semiconductor wafer in a reaction chamber;
- processing the first semiconductor wafer in the reaction chamber;
- and
- providing a polymer-building gas in the reaction chamber during etching of a photoresist layer of the first semiconductor wafer to create a layer of polymer on an interior portion of the reaction chamber;
- packaging the integrated circuit;
- and
- electrically coupling the integrated circuit to a substrate.
A method of manufacturing an electronic system, the method comprising:
- providing an integrated circuit manufactured by a process comprising:
- disposing a first semiconductor wafer in a reaction chamber;
- processing the first semiconductor wafer in the reaction chamber;
- and
- providing a polymer-building gas in the reaction chamber during etching of a photoresist layer of the first semiconductor wafer to create a layer of polymer on an interior portion of the reaction chamber;
- and
- incorporating the integrated circuit into an electronic device.
Dependencies are inferred from the claim text.