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US 7,022,564 B1Granted
Method of forming a low thermal resistance device and structure
AssigneeSemiconductor Components Industries, LLC
InventorsNarayan Raja, Roger P. Stout
Life of this patent
Estimating the term…
Abstract
A semiconductor device is formed to have a shape that reduces the thermal resistance of the semiconductor device.
Claims18
A method of forming a semiconductor device comprising:
- forming doped regions of the semiconductor device in a device shape having a first perimeter that has a first length on a surface of a semiconductor substrate and having a first area;
- and
- arranging the doped regions to form the device shape that is a four sided polygon wherein the first length is approximately 1.8 to 2.4 times a first distance around a circumference of a circle having the first area.
A method of improving the thermal dissipation of a semiconductor device comprising:
- arranging doped regions of the semiconductor device to form a device shape having a first perimeter having a first length and a first area wherein the device shape is a four sided polygon wherein the first length is about 1.8 to 2.4 times a first distance around a circumference of a circle having the first area.
A semiconductor device comprising:
- a device shape having a first perimeter having a first length and a first area wherein the device shape is a four sided polygon wherein the first length is about 1.8 to 2.4 times a first distance around a circumference of a circle having the first area.
Dependencies are inferred from the claim text.