Method of manufacturing semiconductor device
AssigneeOki Electric Industry Co., Ltd.
InventorKazuhiko Asakawa
Life of this patent
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Abstract
A method of manufacturing a semiconductor device includes a providing step and a polishing step. In the providing step, a semiconductor wafer is provided. The semiconductor wafer has a plane area including a plane surface and a peripheral area surrounding the plane area. The peripheral area has a hemispherical surface extending from the plane surface to a wafer end. The distance from an end of the plane surface to the wafer end is about 800–1000 μm. In the polishing step, mechanically and chemically polishing is conducted using a polishing pad with a polishing slurry.
Claims10
A method of manufacturing a semiconductor chip comprising:
- providing a semiconductor wafer having a plane area having a plane surface and a peripheral area surrounding the plane area and having a hemispherical surface extending from the plane surface to a wafer end;
- forming a plurality of resist patterns each having a size equal to the semiconductor chip on the plane area except a grid line portion and a part of the peripheral area;
- removing the hemispherical surface of a remaining part of the peripheral area and the plane surface of the grid line portion so that a step is formed at the remaining part of the peripheral area and the grid line portion;
- and
- mechanically and chemically polishing the wafer using a polishing pad with a polishing slurry.
A method of manufacturing a semiconductor chip comprising:
- providing a semiconductor wafer having a plane area having a plane surface and a peripheral area surrounding the plane area and having a hemispherical surface extending from the plane surface to a wafer end;
- removing a part of the hemispherical surface extending from the plane surface and a grid line portion of the plane area so that a step between the plane surface and the removed surface of the hemispherical surface and within the grid line portion is formed;
- and
- mechanically and chemically polishing the wafer using a polishing pad with a polishing slurry.
Dependencies are inferred from the claim text.