Composition for polishing semiconductor layers
AssigneeRohm and Haas Electronic Materials CMP Holdings, Inc.
InventorsZhendong Liu, John Quanci
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Abstract
An aqueous polishing composition comprises a corrosion inhibitor for limiting removal of an interconnect metal with an acidic pH. The composition includes an organic-containing ammonium salt formed with R1, R2, R3 and R4 are radicals, R1 has a carbon chain length of 2 to 15 carbon atoms. The organic-containing ammonium salt has a concentration that accelerates TEOS removal and decreases removal of at least one coating selected from the group consisting of SiC, SiCN, Si3N4 and SiCO.
Claims10
An aqueous polishing composition comprising:
- a corrosion inhibitor for limiting removal of an interconnect metal;
- an acidic pH;
- abrasive particles;
- and
- an organic-containing ammonium salt formed with
- R1, R2, R3 and R4 are radicals, R1 is an unsubstituted aryl, alkyl, aralkyl, or alkaryl group that has a carbon chain length of 2 to 15 carbon atoms and the organic-containing ammonium salt has a concentration that accelerates TEOS removal and decreases removal of at least one coating selected from the group consisting of SiC, SiCN, Si3N4 and SiCO with at least one polishing pressure less than 21.7 kPa.
An aqueous polishing composition comprising, by weight percent:
- 0.05 to 15 abrasive particles;
- 0 to 10 oxidizing agent;
- 0.0025 to 6 a corrosion inhibitor for limiting removal of an interconnect metal;
- a pH of less than 5;
- and
- 0.001 to 3 organic-containing ammonium salt formed with
- R1, R2, R3 and R4 are radicals, R1 is an unsubstituted aryl, alkyl, aralkyl, or alkaryl group that has a carbon chain length of 2 to 15 carbon atoms and the organic-containing ammonium salt has a concentration that accelerates TEOS removal and decreases removal of at least one coating selected from the group consisting of SiC, SiCN, Si3N4 and SiCO with at least one polishing pressure less than 21.7 kPa.
An aqueous polishing composition comprising, by weight percent:
- 0.1 to 10 silica particles;
- 0 to 10 oxidizing agent;
- 0.25 to 4 benzotriazole;
- a pH of 1.5 to 4 adjusted with an inorganic adjusting agent;
- and
- 0.02 to 2 organic-containing ammonium salt selected from at least one of tetraethyl ammonium salts, tetrabutylammonium salts, benzyltributylammonium salts, benzyltrimethylammonium salts and benzyltriethylammonum salts.
Dependencies are inferred from the claim text.