Substrate processing apparatus and substrate processing method drying substrate by spraying gas
AssigneeDainippon Screen Mfg. Co., Ltd.
InventorAkira Izumi
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AssigneeDainippon Screen Mfg. Co., Ltd.
InventorAkira Izumi
Estimating the term…
A first gas nozzle and a second gas nozzle are fixedly provided in the vicinity of the forward end of a nozzle arm. The nozzle arm is rotated along a locus R while a substrate rinsed with deionized water is rotated, for discharging nitrogen gas from the first and second gas nozzles. Visible moisture is loosely expelled from the upper surface of the substrate by spraying the nitrogen gas from the first gas nozzle, and moisture slightly remaining on a fine pattern or the like can also be completely removed by spraying the nitrogen gas from the second gas nozzle to the same region of the substrate as that sprayed with the nitrogen gas by the first gas nozzle. Consequently, the surface of the substrate can be stably and reliably dried. Thus, a substrate processing apparatus capable of stably and reliably drying the surface of the substrate is provided.
A substrate processing apparatus for spraying gas onto a substrate completely cleaned with deionized water for drying said substrate, comprising:
A substrate processing apparatus spraying gas to a substrate completely cleaned with deionized water for drying said substrate, comprising:
Dependencies are inferred from the claim text.