Die encapsulation using a porous carrier
AssigneeFreescale Semiconuctor, Inc.
InventorsOwen R. Fay, Craig S. Amrine, Kevin R. Lish
Life of this patent
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Abstract
A process for encapsulating an integrated circuit die (403) using a porous carrier (101). In one example, an adhesive structure (e.g. tape) is applied to a porous carrier. Integrated circuit die is then placed on the adhesive structure. The integrated circuit die is then encapsulated to form an encapsulated structure (505). The carrier is then subjected to a solvent that passes through the carrier to reduce the adhesive strength of the adhesive structure for removal of the carrier from the encapsulated structure.
Claims34
A method comprising:
- providing a porous carrier;
- providing an adhesive structure overlying the porous carrier;
- placing a first integrated circuit die over the adhesive structure;
- encapsulating the first integrated circuit die to form an encapsulated structure;
- and
- separating the porous carrier from the encapsulated structure, wherein the adhesive structure comprises an adhesive material in contact with the porous carrier, and wherein the separating the porous carrier from the encapsulated structure comprises using a solvent that is passed through the porous carrier to affect the adhesive structure.
A method comprising:
- providing a porous carrier, wherein the porous carrier comprises aluminum oxide embedded in a glass matrix;
- providing an adhesive structure overlying the porous carrier;
- placing a first integrated circuit die over the adhesive structure;
- encapsulating the first integrated circuit die to form an encapsulated structure;
- and
- separating the porous carrier from the encapsulated structure.
A method comprising:
- providing a porous carrier;
- adhering an adhesive structure to the porous carrier;
- placing at least one integrated circuit die over the adhesive structure;
- encapsulating the at least one integrated circuit die to form an encapsulated structure;
- and
- removing the porous carrier from the encapsulated structure, wherein the removing comprises using a solvent that is passed through the porous carrier to reduce adhesive strength between the adhesive structure and the porous carrier.
A method comprising:
- providing a reusable porous carrier including pores with a pore size diameter of at least 0.02 microns;
- adhering an adhesive structure to the reusable porous carrier;
- placing a plurality of integrated circuit die in an array configuration over the adhesive structure;
- encapsulating the plurality of integrated circuit die to form an encapsulated structure;
- and
- separating the reusable porous carrier from the encapsulated structure, wherein the separating comprises using a solvent that is passed through the porous carrier to reduce adhesive strength between the adhesive structure and the reusable porous carrier.
Dependencies are inferred from the claim text.