13-Pin socket for combination SD/MMC flash memory system

A 13-pin socket apparatus for receiving and reading a memory card having a front edge, parallel first and second side edges that are perpendicular to the front edge, and a chamfer edge extending between the front edge and the first side edge, the memory card also having a plurality of contact pads formed on a surface thereof, wherein the socket apparatus comprises:

• a circuit board having a surface;
• a frame positioned over the surface of the circuit board and defining parallel slots for respectively slidably receiving the first and second side edges of the memory card, and an end wall positioned to abut the front edge of the memory card when the memory card is fully inserted into the socket apparatus with the contact pads facing the circuit board surface;
• and
• a plurality of contact springs mounted on the surface of the circuit board, each of the contact springs including a hook resiliently biased away from the circuit board surface, wherein the plurality of contact springs include:
• a first row of eight hooks aligned parallel to the front wall of the frame,
• a second row of four hooks aligned parallel to the first row and positioned such that the first row is between the second row and the front wall, and
• a thirteenth contact spring having a thirteenth hook positioned between the first and second rows.

A data storage system comprising:

• a memory card including:
• a printed circuit board (PCB) including a front edge, a relatively long side edge, a relatively short side edge located opposite to the relatively long side edge, and a chamfer edge extending between front edge and the relatively short side edge;
• a plurality of contact pads formed on a first surface of the PCB, the plurality of contact pads including a first row of contact pads and a second row of contact pads, the first row being aligned along the front edge of the PCB, and the second row being aligned parallel to the first row and positioned such that the first row is between the second row and the front end of the PCB;
• and
• a two-part housing including:
• an upper cover including an upper wall mounted over the upper surface of the PCB;
• and
• a lower cover including a lower wall mounted over a bottom surface of the PCB, the lower cover being attached to the upper cover,
• wherein the lower cover includes a switch mounting structure, and
• wherein the relative long side edge of the PCB defines an alignment notch that receives the switch mounting structure when the PCB is mounted onto the two-part housing;
• and
• a socket apparatus for receiving and reading the memory card, the socket apparatus including:
• a circuit board having a surface;
• a frame positioned over the circuit board surface and defining parallel slots for slidably receiving the first and second side edges of the memory card, respectively, the frame also including an end wall positioned to abut the front edge of the memory card when the memory card is fully inserted into the socket apparatus with the contact pads facing the circuit board surface;
• a plurality of contact springs mounted on the surface of the circuit board, each of the contact springs including a hook biased away from the circuit board surface such that each of the hooks contacts the memory card surface,
• wherein the plurality of contact springs are arranged such that a first row of hooks are aligned parallel to the front wall of the frame and positioned to contact the first row of contact pads of the memory card when the memory card is fully inserted into the socket apparatus, and a second row of hooks are aligned parallel to the first row and positioned such that the first row of hooks is between the second row of hooks and the front wall, and such that the second row of hooks contact the second row of contact pads of the memory card when the memory card is fully inserted into the socket apparatus,
• wherein the first row of contact pads includes eight substantially rectangular contact pads, each contact pad of the first row having a front end located adjacent to the front edge of the PCB, each contact pad of the first row also having a back end, the first row including a first contact pad located at a first end of the first row adjacent to the chamfer edge, and an eighth contact pad located at a second end of the first row adjacent to the relatively long side edge, and
• wherein the second row of contact pads includes four substantially rectangular contact pads arranged parallel to the first row, each contact pad of the second row having a front end and a back end, the second row including a ninth contact pad located at a first end of the second row adjacent to the chamfer edge, and a twelfth contact pad located at a second end of the first row adjacent to the relatively long side edge.