Wire form heat sink retention module
AssigneeInternational Business Machines Corporation
InventorsTimothy Samuel Farrow, Dean Frederick Herring, William Fred Martin-Otto
Life of this patent
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Abstract
A retention module firmly secures a heat sink for a computer chip. The retention module is oriented about the computer chip on a circuit board. The retention module has a rotatable wire form that has two loops. When the rotatable wire form is rotated, the two loops press against an impingement shelf on the heat sink, forcing the heat sink against the retention module and the computer chip. The two loops are angularly offset to each other, thus compensating for torsion lag between the two loops when the two loops are pressed against the impingement shelf.
Claims9
A system comprising:
- a heat sink having:
- a bottom surface;
- a bottom first end that includes a heat sink impingement shelf, and
- a bottom second end that includes a heat sink retention shelf;
- and
- a retention module having:
- a retention module first end that includes:
- a retention deck, and
- a rotatable wire form having multiple loops,
- a retention module second end that includes:
- a capture shelf,
- wherein upon the heat sink retention shelf being aligned under the capture shelf, the rotatable wire form can be rotated, thus causing the multiple loops to force the heat sink impingement shelf against the retention deck surface, thereby resulting in the bottom surface of the heat sink being pressed against a top surface of a computer chip that is oriented beneath the bottom surface of the heat sink.
Dependencies are inferred from the claim text.