Heat sink for semiconductor components or similar devices, method for producing the same and tool for carrying out said method

A method of producing a heat sink comprising:

• providing a base plate having a surface, at least two spaced apart intermediate ribs on the surface, wherein the spaced apart intermediate ribs extend substantially parallel to each other in a longitudinal direction and define therebetween an insertion groove;
• inserting into the insertion groove at least one cooling rib having a coupling base which engages in the insertion groove, wherein the coupling base is held in an interlocking manner in the insertion groove;
• and
• thereafter forming by pressure on a top surface of the intermediate ribs a plurality of spaced apart transverse ribs on the intermediate ribs, wherein the transverse ribs extend substantially perpendicular to the insertion groove and abut the coupling base of the at least one cooling rib.