Packaged integrated circuit providing trace access to high-speed leads

A packaged integrated circuit comprising:

• a die;
• a package body formed from encapsulant, at least partially enclosing the die;
• a leadframe connected to the die and at least partially enclosed within the package body, and having leads extending from the package body, a subset of the leads of the leadframe being separated by a lead-to-lead pitch, wherein at least two adjacent leads of the leadframe are separated by a space larger than the pitch;
• and
• at least one additional lead connected to the die and disposed on an underside of the package body, the at least one additional lead being connectable to a circuit mounting structure trace passing between the adjacent leads separated by the space larger than the pitch, wherein the at least one additional lead is wire bonded to the die within the package body.

A circuit mounting structure comprising at least one electrical connector, a plurality of traces, and at least one packaged integrated circuit mounted thereon, the packaged integrated circuit comprising:

• a die;
• a package body formed from encapsulant, at least partially enclosing the die;
• a leadframe connected to the die and at least partially enclosed within the package body, and having leads extending from the package body, a subset of the leads of the leadframe being separated by a lead-to-lead pitch, wherein at least two adjacent leads of the leadframe are separated by a space larger than the pitch;
• and
• at least one additional lead connected to the die and exposed adjacent to the die on an interior underside of the package body for connection to a trace of the circuit mounting structure routed from the at least one electrical connector and passing between the adjacent leads separated by the space larger than the pitch.