Method for manufacturing micro electro-mechanical systems using solder balls

A method for manufacturing micro electro-mechanical systems, comprising:

• (a) forming an insulation layer on an upper surface of a semiconductor substrate and patterning the insulation layer;
• (b) forming a structure layer on an upper surface of the patterned insulation layer and etching the structure layer;
• (c) forming an under bump metal on a predetermined position of an upper surface of the structure layer;
• (d) forming a via hole in a glass substrate corresponding to the position of the under bump metal of the structure layer and in a shape such that the via hole is larger in diameter at an upper surface of the glass substrate than at a lower surface of the glass substrate, wherein the glass substrate is bonded to the upper surface of the structure layer and creates a vacuum chamber that protects a structure of the structure layer;
• and
• (e) arranging a solder ball in the via hole and bonding the solder ball to the under bump metal by melting the solder ball.