System and method for a combined contact and non-contact wafer cleaning module

A system for cleaning and rinsing a wafer comprising:

• at least three edge rollers, the at least three edge rollers being capable of supporting a wafer by an edge of the wafer, at least one of the edge rollers being driven and thereby capable of rotating the wafer and at least one of the edge rollers is a movable roller mounted on an edge roller actuator being capable of applying a variable force to the edge of the wafer through the at least one movable edge roller;
• a first actuator;
• a second actuator;
• a first movable scrubbing roller mechanically coupled to the first actuator, the first movable scrubbing roller capable of being moved away from and alternatively to a first side of the wafer by the first actuator;
• a second movable scrubbing roller mechanically coupled the second actuator, the second movable scrubbing roller capable of being moved away from and alternatively to a second side of the wafer by the second actuator, the second side of the wafer opposing the first side of the wafer, wherein the first actuator applies a first force through the first movable scrubbing roller to the first side of the wafer, the first force being substantially perpendicular to the first side of the wafer and the second actuator applies a second force through the second movable scrubbing roller to the second side of the wafer, the second force being substantially perpendicular to the second side of the wafer, wherein a differential force is equal to a difference between the first force and the second force, wherein the edge roller actuator is operatively coupled to the first actuator and the second actuator such that the variable force counteracts the differential force when the differential force is greater than zero;
• at least one first side nozzle directed toward the first side of the wafer;
• and
• at least one second side nozzle directed toward the second side of the wafer.