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US 7,005,227 B2Granted
One component EUV photoresist
AssigneeIntel Corporation
InventorsWang Yueh, Heidi Cao
Life of this patent
Estimating the term…
Abstract
In one embodiment, a photoactive compound may be attached to a polymer backbone. This embodiment may be more resistant to the generation of reactive outgassing components and may exhibit better contrast.
Claims8
A method comprising:
- forming a photoresist by attaching a photoactive compound including diazonaphthoquinone to a polymer backbone;
- and
- exposing said photoresist to extreme ultraviolet radiation.
Dependencies are inferred from the claim text.