Method and apparatus for controlling rippling during optical proximity correction

A computer-readable storage medium storing instructions that when executed by a computer cause the computer to perform a method for controlling rippling caused by optical proximity correction during an optical lithography process used in manufacturing an integrated circuit, the method comprising:

• selecting a first evaluation point for a given segment that is part of an edge in a layout of the integrated circuit;
• selecting a second evaluation point for the given segment;
• computing a first deviation from a target location for the given segment at the first evaluation point;
• computing a second deviation for the given segment at the second evaluation point;
• and
• controlling rippling for the given segment, if necessary, based upon a measurement of rippling computed from multiple deviations at multiple evaluation points, including the first deviation at the first evaluation point and the second deviation at the second evaluation point, wherein controlling rippling involves breaking the given segments into multiple segments in order to control ripple.

An apparatus for controlling rippling caused by optical proximity correction during an optical lithography process used in manufacturing an integrated circuit, comprising:

• a selection mechanism that is configured to,
• select a first evaluation point for a given segment that is part of an edge in a layout of the integrated circuit, and to
• select a second, evaluation point for the given segment;
• a deviation computing mechanism that is configured to,
• compute a first deviation from a target location for the given segment at the first evaluation point, and to
• compute a second deviation for the given segment at the second evaluation point;
• and
• a ripple controlling mechanism that is configured to control ripple for the given segment, if necessary, based upon a measurement of rippling computed from multiple deviations at multiple evaluation points, including the first deviation at the first evaluation point and the second deviation at the second evaluation point, wherein controlling rippling involves breaking the given segments into multiple segments in order to control ripple.

A mask to be used in an optical lithography process for manufacturing an integrated circuit, wherein the mask is created through a process that controls rippling caused by optical proximity correction, the process comprising:

• selecting a first evaluation point for a given segment that is part of an edge in a layout of the integrated circuit;
• selecting a second evaluation point for the given segment;
• computing a first deviation from a target location for the given segment at the first evaluation point;
• computing a second deviation for the given segment at the second evaluation point;
• and
• controlling rippling for the given segment, if necessary, based upon a measurement of rippling computed from multiple deviations at multiple evaluation points, including the first deviation at the first evaluation point and the second deviation at the second evaluation point, wherein controlling rippling involves breaking the given segments into multiple segments in order to control ripple.

An integrated circuit created through an optical lithography process using a mask, wherein the mask is created through a process that controls rippling caused by optical proximity correction, the process comprising:

• selecting a first evaluation point for a given segment that is part of an edge in a layout of the integrated circuit;
• selecting a second evaluation point for the given segment;
• computing a first deviation from a target location for the given segment at the first evaluation point;
• computing a second deviation for the given segment at the second evaluation point;
• and
• controlling rippling for the given segment, if necessary, based upon a measurement of rippling computed from multiple deviations at multiple evaluation points, including the first deviation at the first evaluation point and the second deviation at the second evaluation point, wherein controlling rippling involves breaking the given segments into multiple segments in order to control ripple.

A means for controlling rippling caused by optical proximity correction during an optical lithography process used in manufacturing an integrated circuit, comprising:

• a selection means for,
• selecting a first evaluation point for a given segment that is part of an edge in a layout of the integrated circuit, and for
• selecting a second evaluation point for the given segment;
• a deviation computing means for,
• computing a first deviation from a target location for the given segment at the first evaluation point, and for
• computing a second deviation for the given segment at the second evaluation point;
• and
• a ripple controlling means for controlling ripple for the given segment, if necessary, based upon a measurement of rippling computed from multiple deviations at multiple evaluation points, including the first deviation at the first evaluation point and the second deviation at the second evaluation point, wherein controlling rippling involves breaking the given segments into multiple segments in order to control ripple.