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US 7,002,802 B2Granted
Cooling device, electronic apparatus, display unit, and method of producing cooling device
AssigneeSony Corporation
InventorsMotosuke Ohmi, Eisaku Kato, Minehiro Tonosaki
Life of this patent
Estimating the term…
Abstract
A cooling device includes a flow-path substrate, an intermediate substrate, and a lid-substrate each made of a polyimide resin, and a condenser substrate incorporated into holes of the intermediate substrate and an evaporator substrate which are made of a metal having a high thermal conductivity, whereby heat from a heat source can be enclosed into the evaporator substrate and the condenser substrate, so that the quantity of the latent heat can be substantially increased.
Claims1
A cooling device comprising:
- a first member having at least a wick as a component of a heat pipe;
- a second member physically separated from the first member and provided with a condenser as a component of the heat pipe,
- the first member and the second member having channels made of at least one of a metal and a material having a thermal conductivity substantially equal to that of a metal;
- and
- a flexible substrate interposed between the first member and the second member and having a flow-path formed therein so as to connect the wick and the condenser to each other,
- the flow-path formed in the flexible substrate has a diamond-like carbon film formed therein, wherein
- at least one of the first member and the second member being made of a polyimide resin.
4 more elements
Dependencies are inferred from the claim text.