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US 7,002,795 B2Granted
Low noise heatsink
AssigneeIntel Corporation
InventorsMark A. Trautman, George Daskalakis
Life of this patent
Estimating the term…
Abstract
A thermal management device includes a thermally conductive core, a thermally conductive frame positioned around the core, the frame defining at least one opening, and at least one thermally conductive insert disposed in the opening in the frame.
Claims28
An apparatus, comprising:
- a thermally conductive core;
- a thermally conductive frame positioned around the core, the frame defining at least one opening;
- and
- at least one thermally conductive insert disposed in the opening in the frame,
- wherein the core includes a post and base, with the base protruding from the frame.
2 more elements
An apparatus, comprising:
- a thermally conductive core;
- a thermally conductive frame positioned around the core, wherein the frame includes a framework of members defining an array of openings;
- and
- a plurality of thermally conductive inserts respectively disposed in the openings in the frame.
1 more element
An apparatus, comprising:
- a thermally conductive core;
- a thermally conductive frame positioned around the core, the frame defining at least one opening;
- and
- at least one thermally conductive insert disposed in the opening in the frame,
- wherein the at least one insert includes at least one insert having a folded fin structure.
2 more elements
A method, comprising:
- providing a thermally conductive core;
- positioning a thermally conductive frame around the core, the frame defining at least one opening;
- and
- inserting a thermally conductive insert in the opening in the frame,
- wherein the core includes a post and base, with the base protruding from the frame.
2 more elements
A method, comprising:
- providing a thermally conductive core;
- positioning a thermally conductive frame around the core, wherein the frame includes a framework of members defining an array of openings;
- and
- inserting a plurality of thermally conductive inserts in respective openings of the array of openings.
1 more element
A method, comprising:
- providing a thermally conductive core;
- positioning a thermally conductive frame around the core, the frame defining at least one opening;
- and
- inserting a thermally conductive insert in the opening in the frame,
- wherein the insert includes an insert having a folded fin structure.
2 more elements
A system, comprising:
- a heatsink assembly, comprising:
- a thermally conductive core;
- a thermally conductive frame positioned around the core, the frame defining at least one opening, wherein the core includes a post and base, with the base protruding from the frame;
- at least one thermally conductive insert disposed in the opening in the frame;
- and
- an electronic component thermally coupled to the core of the heatsink.
3 more elements
A system, comprising:
- a heatsink assembly, comprising:
- a thermally conductive core;
- a thermally conductive frame positioned around the core,
- wherein the frame includes a framework of members defining an array of openings;
- a plurality of thermally conductive inserts respectively disposed in the openings in the frame;
- and
- an electronic component thermally coupled to the core of the heatsink.
4 more elements
A system, comprising:
- a heatsink assembly, comprising:
- a thermally conductive core;
- a thermally conductive frame positioned around the core, the frame defining at least one opening;
- at least one thermally conductive insert disposed in the opening in the frame;
- and
- an electronic component thermally coupled to the core of the heatsink,
- wherein the at least one insert includes at least one insert having a folded fin structure.
4 more elements
A system, comprising:
- a heatsink assembly, comprising:
- a thermally conductive core;
- a thermally conductive frame positioned around the core, the frame defining at least one opening;
- at least one thermally conductive insert disposed in the opening in the frame;
- an electronic component thermally coupled to the core of the heatsink;
- and
- a fan mounted to the heatsink.
4 more elements
Dependencies are inferred from the claim text.