Floating entrance guard for preventing electrical short circuits
AssigneePTS Corporation
InventorDavid Miller
Life of this patent
Estimating the term…
Abstract
Methods and apparatuses are provided for protecting an interconnect line in a microelectromechanical system. The interconnect line is disposed over a substrate for conducting electrical signals, such as from a bonding pad to a mechanical component to effect movement as desired of the mechanical component. A first protective covering is disposed over a first portion of the interconnect line and a second protective covering is disposed over a second portion of the interconnect line. The first protective covering is provided in electrical communication with the substrate and the second protective covering is electrically isolated from the substrate.
Claims44
A method for protecting an interconnect line disposed over a substrate to conduct electrical signals in a microelectromechanical system, the method comprising:
- forming a first protective covering over a first portion of the interconnect line, wherein the first protective covering is in electrical communication with the substrate;
- and
- forming a second protective covering over a second portion of the interconnect line, wherein the second protective covering is electrically isolated from the substrate,
- wherein the interconnect line and at least one of the first and second protective coverings are separated only by atmosphere.
An interconnect shield for protecting an interconnect line disposed over a substrate to conduct electrical signals in a microelectromechanical system, the interconnect shield comprising:
- a first protective covering disposed over a first portion of the interconnect line, wherein the first protective covering is in electrical communication with the substrate;
- and
- a second protective covering disposed over a second portion of the interconnect line, wherein the second protective covering is electrically isolated from the substrate, wherein the interconnect line and at least one of the first and second protective coverings are separated only by atmosphere.
A method for fabricating a microelectromechanical system, the method comprising:
- forming a bonding pad over an electrically conductive substrate;
- forming a mechanical component over the substrate, wherein the mechanical component is adapted to engage in movement relative to the substrate;
- forming an electrically conductive interconnect line along a longitudinal line between the bonding pad and the mechanical component;
- forming a first protective covering over a first portion of the interconnect line, wherein the first protective covering is electrically conductive and is in electrical communication with the substrate;
- and
- forming a second protective covering over a second portion of the interconnect line, wherein the second protective covering is electrically isolated from the substrates
- wherein the interconnect line and at least one of the first or second protective coverings are separated only by atmosphere.
A microelectromechanical device comprising:
- an electrically conductive substrate;
- a bonding pad disposed over the substrate;
- a mechanical component disposed over the substrate, wherein the mechanical component is adapted to engage in movement relative to the substrate;
- an electrically conductive interconnect line disposed over the substrate along a longitudinal line between the bonding pad and the mechanical component;
- a first protective covering disposed over a first portion of the interconnect line, wherein the first protective covering is electrically conductive and is in electrical communication with the substrate;
- and
- a second protective covering disposed over a second portion of the interconnect line, wherein the second protective covering is electrically isolated from the substrate
- wherein the interconnect line and at least one of the first and second protective coverings are separated only by atmosphere.
An interconnect shield for protecting an interconnect line disposed over a substrate to conduct electrical signals in a microelectromechanical system, the interconnect shield comprising:
- first protective means for covering a first portion of the interconnect line, wherein the first protective means is in electrical communication with the substrate;
- and
- second protective means for covering a second portion of the interconnect line, wherein the second protective means is electrically isolated from the substrate, wherein the interconnect line and at least one of the first and second protective means are separated only by atmosphere.
Dependencies are inferred from the claim text.