Semiconductor integrated circuit device having a dummy conductive film and method of manufacturing the same

A method of manufacturing a semiconductor integrated circuit device, comprising the steps of:

• (a) forming two or more element forming regions over a surface portion of a semiconductor substrate, said element forming regions being defined by an insulating film and each extending in a first direction and being arranged in a second direction perpendicular to said first direction;
• (b) forming a plurality of memory cells over main surfaces of said element forming regions;
• and
• (c) forming a conductive film over said semiconductor substrate, said conductive film having at least a portion extending in said second direction,
• wherein said element forming regions have end portions positioned below said portion of said conductive film.

A method of manufacturing a semiconductor integrated circuit device comprising steps of:

• (a) forming element isolation regions in a semiconductor substrate so as to provide two or more element forming regions over a surface of said semiconductor substrate;
• (b) forming a plurality of memory cells over main surfaces of said element forming regions;
• and
• (c) forming a conductive film over said semiconductor substrate,
• wherein said element forming regions extend in a first direction, and
• wherein said conductive film has at least a portion extending in a second direction, perpendicular to said first direction, and disposed over end portions of said element forming regions.

A method of manufacturing a semiconductor integrated circuit device, comprising the steps of:

• (a) forming grooves in a semiconductor substrate;
• (b) depositing insulating material in said grooves to define two or more element forming regions over a surface portion of said substrate, said element forming regions extending in a first direction and being arranged in a second direction perpendicular to said first direction;
• (c) forming a plurality of memory cells over main surfaces of said element forming regions;
• and
• (d) forming a conductive film over said semiconductor substrate, said conductive film having a first portion which extends in said first direction along a first side of said surface portion of said substrate, arid a second portion which extends in said second direction along a second side of said surface portion and which is disposed over end portions of said element forming regions.