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US 7,000,683 B2Granted
Heatsink device
AssigneeMin-Ching Huang
InventorsChen Jiunn Liang, Kuo Yu Yu
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Abstract
A heatsink device includes a heat conducting interface, a press plate mounted on the heat conducting interface, and a plurality of heat conducting metal threads pressed between the heat conducting interface and the press plate. Thus, the heat conducting metal threads are extended in a horizontal direction without bending or turning so as to dissipate the heat rapidly and smoothly, to prevent the heat from the heat source from being concentrated on the heat conducting interface, so that the heatsink device has the optimum heatsink effect.
Claims7
A heatsink device, comprising:
- a heat conducting interface;
- a press plate mounted on the heat conducting interface;
- and
- a plurality of heat conducting metal threads pressed between the heat conducting interface and the press plate;
- wherein
- each of the heat conducting metal threads has two distal ends protruded outward from the two sides of the heat conducting interface and the press plate respectively.
3 more elements
Dependencies are inferred from the claim text.