US 7,000,623 B2Granted

Apparatus and method for substrate preparation implementing a surface tension reducing process

AssigneeLam Research Corporation

InventorsChristopher M. Welsh, Jack T. Matsumoto

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Abstract

Methods and systems for preparing a substrate implementing a surface tension reducing process are provided. In one example, a substrate preparation system includes a chuck which fingers for edge gripping the substrate. The chuck is hollow to provide simultaneous access to both active and backside surfaces of the substrate, and is configured to rotate the substrate. The system includes dispense arms positioned over the substrate surfaces. The dispense arms are capable of moving between a center region and a periphery of the substrate surfaces, and each dispense arm includes a pair of supply lines for delivering fluids over the substrate surfaces. A connection couples the upper dispense arm with the lower dispense arm so that the dispense arms synchronously move between the center region and the periphery of the substrate, and remain aligned on opposite surfaces of the substrate.

Claims19

Dependent claims

A system for rinsing and drying a substrate, comprising:

(a) a chuck having fingers for edge gripping the substrate, the chuck being configured to rotate the substrate;
(b) an upper dispense arm positioned over an active surface of the substrate, the upper dispense arm being capable of moving between a center region and a periphery of the active surface of the substrate, the upper dispense arm further having a pair of supply lines for delivering fluids over the active surface of the substrate;
(c) a lower dispense arm positioned below a backside surface of the substrate and being magnetically coupled to the upper dispense arm with a governor to limit a range of movement of the lower dispense arm, the lower dispense arm being capable of moving between a center region and a periphery of the backside surface of the substrate, and having a pair of supply lines for delivering fluids over the backside surface of the substrate;
and
(d) a spray shield surrounding the substrate in the chuck, the spray shield having a section of the spray shield slideably configured to provide access to the chuck and to form a substantially solid spray shield surrounding the chuck,
wherein when the upper dispense arm and the lower dispense arm move between the center region and the periphery of the substrate, a magnetic coupling provides that the upper dispense arm and the lower dispense arm remain aligned on opposite surfaces of the substrate, and the governor limits the movement of the lower dispense arm prior to a cessation of movement by the upper dispense arm.

3 more elements

A system for rinsing and drying a substrate, comprising:

(a) a hollow chuck having fingers for edge gripping the substrate, the hollow chuck being attached to a hollow spindle and configured to rotate the substrate;
(b) a first dispense arm positioned adjacent to an active surface of the substrate, the first dispense arm being capable of moving between a center region and a peripheral edge of the active surface of the substrate, the first dispense arm further having a pair of supply lines for delivering fluids over the active surface of the substrate;
(c) a second dispense arm positioned adjacent to a backside surface of the substrate, the second dispense arm being magnetically coupled to the first dispense arm with a governor to limit a range of movement of the second dispense arm and capable of moving between a center region and a peripheral edge of the backside surface of the substrate, the second dispense arm further having a pair of supply lines for delivering fluids over the backside surface of the substrate and;
(d) a spray shield surrounding the substrate in the hollow chuck, the spray shield having a section of the spray shield slidably configured to provide access to the hollow chuck and to form a substantially solid spray shield encircling the hollow chuck,
wherein when the first dispense arm and the second dispense arm move between the center region and the periphery of the substrate, a magnetic coupling provides that the first dispense arm and the second dispense arm remain aligned on opposite surfaces of the substrate, and the governor limits the movement of the second dispense arm prior to a cessation of movement by the first dispense arm.

2 more elements

Dependencies are inferred from the claim text.

Facts

Application: 10/151,664Filed 17 May 2002 · us provisional application
Priority: 18 May 2001
Published: US 2003/0000034 A12 Jan 2003
Granted: 21 Feb 2006
Term ends: Not estimatedThe source records don’t support an estimate.

Classification5 codes

H10P 72/0414
For wet cleaning or washing: using mainly spraying means, e.g. nozzles
H10P 72/0408
For cleaning followed by drying, rinsing, stripping, blasting or the like: for drying
Y10S 134/902
Cleaning and liquid contact with solids: semiconductor wafer
H10P
Generic processes or apparatus for the manufacture or treatment of devices covered