Ruggedized electronic module cooling system
AssigneeRockwell Collins, Inc.
InventorsSteve I. Lebo, Scott J. Sellner
Life of this patent
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Abstract
A ruggedized electronics sub-system module is disclosed. The ruggedized electronics sub-system module includes a ruggedized housing and an electronic device supported by the housing. The ruggedized electronics sub-system module also includes an electrical connector coupled to the electronic device and supported by the housing. The ruggedized electronics sub-system module further includes a plurality of ruggedized cooling pins extending from the housing. The plurality of pins are spaced so as to allow for natural convective currents or forced air to be used for cooling the electronic device.
Claims16
A ruggedized electronics sub-system module, comprising:
- a ruggedized housing, sealed to be impermeable by liquids;
- an electronic device supported by the housing;
- an electrical connector coupled to the electronic device and supported by the housing;
- and
- a plurality of ruggedized conically shaped cooling pins extending from the housing, the plurality of pins being spaced so as to allow for natural convective currents to be used for cooling the electronic device and the plurality of pins being spaced so as not to substantially impede the natural convective currents, wherein the cooling pins have a rounded tip at the end extended furthest from the housing.
A cooling pin disposed on the outer surface of an electronics module, comprising:
- a base portion coupled to the outer surface of the electronics module, the base portion having a diameter, the electronics module providing an impermeable housing for modular electronic components;
- a solid upstanding portion extending from the base;
- and
- a rounded tip portion coupled to the solid upstanding portion, the combination of the solid upstanding portion and the tip portion forming a height.
An electronics module housing, comprising:
- an outer surface completely encasing an electronic device;
- a plurality of conically shaped cooling pins sparsely dispersed on the outer surface and extending therefrom the cooling pins having a rounded tip at the end extending furthest from the housing;
- wherein the plurality of cooling pins are integrally formed with the outer surface in a ruggedized configuration that allows for natural convective currents to be used for cooling the electronic device and the plurality of pins being spaced so as not to substantially impede the natural convective currents around the module, when the module is placed next to another module.
Dependencies are inferred from the claim text.