Low momentum loss fluid manifold system
AssigneeIsothermal Systems Research, Inc.
InventorsTahir Cader, Robert J. Ressa
Life of this patent
Estimating the term…
Abstract
The present invention is a two-phase liquid cooling system that cools a plurality of electronic components connected in parallel. A pump delivers a cooling fluid, as a liquid, to a supply manifold wherein it splits into distinct branch lines. Preferably, the branch lines feed coolant to individual spray modules. The liquid coolant removes heat from the components to be cooled. The resulting liquid and vapor mixture exit the spray modules via a plurality of return branches. Each individual return branch feeds into a return manifold at an acute angle. The angular transitions between the return branches and the return manifold provides low manifold losses and a more efficient system.
Claims26
A method of removing a liquid and vapor mixture from a plurality of spray cooling modules connected in parallel within a closed loop liquid cooling system, said plurality of spray cooling modules located within a plurality of chassis mounted to a rack, said plurality of chassis housing a plurality of heat generating electronic components, the method comprising:
- using a plurality of return branches fluidly connected to said plurality of spray modules;
- fluidly connecting said plurality of return branches at acute angles to a return manifold;
- fluidly connecting said return manifold to a heat exchanger;
- and
- providing the means for flexibly configuring said plurality of chassis within said rack.
A method of removing a liquid and vapor mixture from a plurality of thermal management modules connected in parallel within a closed loop-liquid cooling system, said plurality of thermal management modules located within a plurality of chassis mounted to a rack, said plurality of chassis housing a plurality of heat generating electronic components in thermal contact with said plurality of thermal management units, the method comprising:
- using a plurality of primary return branches fluidly connected to said plurality of thermal management modules;
- fluidly connecting said plurality of primary return branches to a plurality of secondary return branches, wherein said plurality of primary return branches join said plurality of secondary return branches at acute angles;
- fluidly connecting said plurality of secondary return branches to a return manifold;
- fluidly connecting said return manifold to a heat exchanger;
- and
- providing the means for flexibly configuring said plurality of chassis within said rack.
A method of removing a liquid and vapor mixture from a plurality of thermal management modules connected in parallel within a closed loop liquid cooling system, said plurality of thermal management modules located within a plurality of chassis mounted to a rack, said plurality of chassis housing a plurality of heat generating electronic components in thermal contact with said plurality of thermal management units, the method comprising:
- using a plurality of primary return branches fluidly connected to said plurality of thermal management modules;
- fluidly connecting said plurality of primary return branches to a plurality of secondary return branches, wherein said plurality of primary return branches join said plurality of secondary return branches at acute angles;
- fluidly connecting said plurality of secondary return branches to a return manifold, wherein said secondary return branches join said return manifold at acute angles;
- fluidly connecting said return manifold to a heat exchanger;
- and
- providing the means for flexibly configuring said plurality of chassis within said rack.
A method of removing a liquid and vapor mixture from a plurality of thermal management modules connected in parallel within a closed loop liquid cooling system, said plurality of thermal management modules located within a plurality of chassis mounted to a rack, said plurality of chassis housing a plurality of heat generating electronic components in thermal contact with said plurality of thermal management units, the method comprising:
- using a plurality of return branches fluidly connected to said plurality of thermal management modules, said plurality of return branches having a plurality of return branch flow vectors;
- fluidly connecting said plurality of return branches to a return manifold, said return manifold having a return manifold flow vector;
- wherein said plurality return branch flow vectors have a component in the direction of said return manifold flow vector;
- fluidly connecting said return manifold to a heat exchanger;
- and
- providing the means for flexibly configuring said plurality of chassis within said rack.
A method of removing a liquid and vapor mixture from a plurality of thermal management modules connected in parallel within a closed loop liquid cooling system, said plurality of thermal management modules located within a plurality of chassis mounted to a rack, said plurality of chassis housing a plurality of heat generating electronic components in thermal contact with said plurality of thermal management units, the method comprising:
- using a plurality of primary return branches fluidly connected to said plurality of thermal management modules, said plurality of primary return branches having a plurality of primary return branch flow vectors;
- fluidly connecting said plurality of primary return branches to a plurality of secondary return branches, said plurality of secondary return branches having a plurality of secondary return branch flow vectors;
- wherein each of said plurality of primary return branch flow vectors have a component in the direction of said plurality of secondary return branch flow vectors;
- wherein said plurality of secondary return branches are fluidly connected to a return manifold having a return manifold flow vector;
- wherein each of said plurality of secondary return branch flow vectors have a component in the direction of said return manifold flow vector;
- fluidly connecting said return manifold to a heat exchanger;
- and
- providing the means for flexibly configuring said plurality of chassis within said rack.
A liquid cooling system comprising:
- a pump for pressurizing a supply of liquid coolant;
- a supply system fluidly connected to said pump and for delivering said supply of liquid coolant to a plurality of thermal management modules contained within a plurality of electronic enclosures mounted to an equipment rack, said plurality of thermal management modules in thermal contact with a plurality of heat generating components within said plurality of electronic enclosures;
- wherein said plurality of thermal management modules cool said plurality of heat generating components by transforming said supply of liquid coolant into a supply of two-phase fluid;
- means for returning and minimizing fluid momentum losses of said two-phase fluid between said plurality of thermal management units and a heat exchanger;
- wherein said heat exchanger transforms said supply of two-phase fluid back to said supply of liquid coolant and to said pump;
- and
- means for providing configuration flexibility of said plurality of chassis within said rack.
Dependencies are inferred from the claim text.