Method of smoothing the outline of a useful layer of material transferred onto a support substrate
AssigneeS.O.I.Tec Silicon on Insulator Technologies
InventorBruno Ghyselen
Life of this patent
Estimating the term…
Loading patent…
AssigneeS.O.I.Tec Silicon on Insulator Technologies
InventorBruno Ghyselen
Estimating the term…
A method of providing a regular outline in a useful layer of material that is transferred from a source substrate onto a support substrate during the fabrication of a composite substrate for subsequent use in electronics, optics, or optoelectronics. The technique includes providing a shoulder on a front face of one of the source or support substrates about its periphery. The shoulder defines an inner projecting zone that has a top face, a sidewall and a regular outline. Next, the method includes molecularly bonding the top face of the projecting zone to a receiving face of the other of the source or support substrates, and removing a portion of the projecting zone from the source substrate to provide the useful layer having the regular outline on the support substrate.
A method of providing a regular outline in a useful layer of material that is transferred from a source substrate onto a support substrate during the fabrication of a composite substrate for subsequent use in electronics, optics, or optoelectronics, which comprises:
Dependencies are inferred from the claim text.