US 6,944,022 B1 · Ruggedized electronics enclosure

Abstract

The present invention relates to a ruggedized enclosure for housing and protecting electronic circuits. The enclosure utilizes a top compartment for housing the circuit and a cooling assembly rigidly coupled to the top compartment. The cooling assembly utilizes a passive radiator to for a rigid truss plate structure. The truss plate structure rigidifies the enclosure helping to protect the enclosure and circuit from destructive shock events and destructive vibration events. The cooling assembly further provides an efficient heat exchange for removing heat from the electronic circuit. A method for protecting an electronic circuit utilizing a rigid truss plate structure is also provided.

Claims8

Dependent claims

A ruggedized electronics enclosure for housing an electronic circuit comprising:

a first area configured to house the electronic circuit;
a cooling assembly comprising a rigid truss plate structure, rigidly coupled to first area and thermally coupled to the electronic circuit, the first area, cooling assembly, and electronic circuit providing a rigid structure that does not substantially deform in response to one or more destructive shock events, to protect the electronic circuit against said one or more destructive shock events;
and
wherein a first axis aligned with the length of the ruggedized enclosure is in a first direction.

1 more element

Dependencies are inferred from the claim text.

Facts

Application

10/850,523Filed 19 May 2004 · continuation

Priority

30 Aug 2002

Granted

13 Sep 2005

Term ends

Not estimatedThe source records don’t support an estimate.

Classification6 codes

H05K 7/20418
Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing: the radiating structures being additional and…
H05K 7/1434
Housings: for electronics exposed to high gravitational force; Cylindrical housings
H05K 7/20254
Using a liquid coolant without phase change in electronic enclosures: cold plates transferring heat from heat source to coolant
H05K 7/20445
Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing: the coupling…

Ruggedized electronics enclosure

Life of this patent

Ruggedized electronics enclosure

Life of this patent

Abstract

Claims8