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US 6,933,100 B2Granted
Method of forming a minute resist pattern
AssigneeClariant Finance (BVI) Limited
InventorsAkihiko Igawa, Jun Ikemoto
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AssigneeClariant Finance (BVI) Limited
InventorsAkihiko Igawa, Jun Ikemoto
Estimating the term…
A method of forming a minute resist pattern wherein a positive-working photoresist composition containing 3 to 15 parts by weight of a quinone diazide group-containing photosensitizer relative to 100 parts by weight of alkali-soluble novolak resin is developed by an aqueous organic or inorganic alkali solution having a lower alkali concentration than that of the conventional one as the developer. The preferable example of the organic alkali materials in the developer is quaternary ammonium hydroxide, and the preferable example of the inorganic alkali materials in the developer is alkali metal hydroxide. The concentrations of the quaternary ammonium hydroxide and the alkali metal hydroxide in the developing solution are 2.2% by weight or less and 0.4% by weight or less respectively. Using such developing solution, high sensitivity, a high film retention rate, high resolution, low process dependency of dimension accuracy, and a formation of excellent pattern profile can be achieved.
A method of forming a minute resist pattern, comprising forming a coating of a positive photoresist composition containing a quinone diazide group-containing photosensitizer in an amount of 3 to 15 parts by weight relative to 100 parts by weight of alkali-soluble novolak resin, imagewise exposing the photoresist coating, and developing the photoresist coating using a developer consisting essentially of 2.2 % by weight or less aqueous solution of a quaternary ammonium hydroxide represented by the general formula (1):
Dependencies are inferred from the claim text.