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US 6,913,027 B2Granted
Resist stripping method and apparatus
AssigneeAsahi Sunac Corporation
InventorsMasahiko Amari, Yoshiyuki Seike
Life of this patent
Estimating the term…
Abstract
A method and an apparatus capable of stripping resist efficiently in a short amount of time. A stripping solution under high pressure is jetted from a nozzle to a rotating wafer. The resist layer on the wafer is applied with the jetted stripping solution, and the resist layer can be efficiently stripped in a short amount of time by the multiplied effect by the physical effect caused by the impact of the jetted stripping solution and the chemical effect of the stripping solution.
Claims5
A method for stripping resist from a substrate, comprising the step of:
- jetting stripping solution to the substrate at sufficiently high fluid pressure to achieve a collective removal effect of physically cracking the resist due to the impact of the jetted fluid without damaging the substrate combined with a chemical removal by the stripping solution of the resist from the substrate.
Dependencies are inferred from the claim text.