Method for electrically and mechanically connecting microstructures using solder
AssigneeThe Regents of the University of Michigan
InventorsDavid F. Lemmerhirt, Kensall D. Wise
Life of this patent
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Abstract
A method and system for locally connecting microstructures and devices formed thereby are provided wherein localized solder-bonding creates bonds between pairs of microstructures found on miniature flexible cables and silicon microsystem platforms. Multi-lead contact to the pads are detected automatically, triggering an embedded heater or heaters to initiate solder melting. This approach enables delicate microstructures to be connected and disconnected from microsystem platforms in the field, and is implemented with a process that is compatible with monolithic integration of circuits.
Claims8
A method for locally connecting a pair of microstructures, the method comprising the steps of:
- aligning the microstructures in close proximity to one another;
- automatically determining when the microstructures are aligned in close proximity to one another and providing a corresponding signal;
- controllably melting solder over surfaces of the aligned microstructures in response to the signal;
- and
- allowing the melted solder to solidify to mechanically and electrically connect the microstructures together wherein one of the microstructures has an electrical property and wherein the step of automatically determining includes the step of measuring the electrical property.
A method for locally connecting a plurality of microstructures, the method comprising the steps of:
- aligning the microstructures to form aligned pairs of microstructures, wherein the microstructures of each aligned pair of microstructures are in close proximity to one another;
- automatically determining when the microstructures of each pair are aligned in close proximity to one another and providing a corresponding signal;
- controllably melting solder over surfaces of desired aligned pairs of microstructures in response to the signal;
- and
- allowing the melted solder to solidify to mechanically and electrically connect desired pairs of the microstructures together wherein one microstructure of each pair has an electrical property and wherein the step of automatically determining includes the step of measuring the electrical property.
Dependencies are inferred from the claim text.