Fabrication of semiconductor devices with air gaps for ultra low capacitance interconnections and methods of making same

A semiconductor device having at least one air gap therein comprising:

• a substrate;
• at least one conductive line or lead;
• at least one air gap;
• and
• an overcoat layer,
• wherein the at least one air gap is produced in accordance with a method comprising the steps of:
• (I) forming a patterned layer of sacrificial material on a substrate corresponding to a pattern of one or more gaps to be formed in the semiconductor structure;
• (II) depositing a conductive material on the substrate within regions bordered by the sacrificial material;
• (III) forming an overcoat layer of material overlying the patterned layer of sacrificial material and conductive material in the regions bordered by the sacrificial material;
• (IV) causing the sacrificial material to decompose into one or more gaseous decomposition products;
• and
• (V) removing at least one of the one or more gaseous decomposition products by passage through the overcoat layer so that one or more air gaps are formed within the semiconductor structure,
• wherein the sacrificial material is a polymer composition selected from one or more polycarbonate polymers, polyester polymers, polyether polymers, methacrylate polymers, acrylate polymers, or mixtures thereof;
• and
• wherein the overcoat layer is free of any closed holes contiguous with the air gap or gaps.

A semiconductor device having one or more air gaps therein produced in accordance with a method comprising the steps of:

• using at least one sacrificial material to occupy simultaneously or sequentially at least two closed interior volumes in a semiconductor structure, wherein the at least two closed interior volumes are on different levels of the semiconductor structure;
• causing the at least one sacrificial material occupying the at least two closed interior volumes to decompose either simultaneously or sequentially into one or more gaseous decomposition products;
• and
• removing at least one of the one or more gaseous decomposition products by passage through at least one solid layer contiguous to the interior volume;
• and
• wherein the solid layer is free of any closed holes contiguous with the closed interior volumes.

A semiconductor device having one or more air gaps therein produced in accordance with a method comprising the steps of:

• using a sacrificial material to occupy at least one first closed interior volume in a semiconductor structure and using a conductive material to occupy at least one second closed interior volume in a semiconductor structure, the sacrificial material in the at least one first closed interior volume and the conductive material in the at least one second closed interior volume defining at least one gap therebetween;
• forming an overcoat layer of material on the sacrificial material and the conductive material with the overcoat material extending into the at least one gap;
• causing the sacrificial material to decompose into one or more gaseous decomposition products;
• and
• removing at least one of the one or more gaseous decomposition products by passage through the overcoat layer so that one or more air gaps are formed within the semiconductor structure, thereby yielding overcoated conductive structures.

A semiconductor structure comprising:

• a substrate;
• a sacrificial material supported on the substrate;
• a conductive material supported on the substrate and spaced apart from the sacrificial material;
• an overcoat layer overcoating the sacrificial material and the conductive material and extending into the one or more spaces between the sacrificial material and the conductive material.

A semiconductor structure comprising:

• a substrate;
• a sacrificial material supported on the substrate;
• a conductive material supported on the substrate and spaced apart from the sacrificial material;
• an overcoat layer overcoating the sacrificial material and the conductive material and extending into the one or more spaces between the sacrificial material and the conductive material,
• wherein the sacrificial material has been removed by decomposition through the overcoat layer.