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US 6,888,064 B2Granted
Modular packaging arrangements and methods
AssigneeInternational Business Machines Corporation
InventorDon Alan Gilliland
Life of this patent
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Abstract
The present invention relates generally to chip packaging and methods of packaging and, more particularly, to compact packaging of chips and methods thereof in electronic environments that minimize undesired electronic effects, promote speed, and enhance packaging versatility.
Claims7
A packaging apparatus comprising:
- a chip module including a housing assembly and a chip assembly within the housing assembly;
- the housing assembly including at least one socket to receive at least one functional component assembly therein;
- at least one functional component assembly to be removably received within the socket and coupled to the chip assembly in an overlying juxtaposed relationship;
- the functional component assembly comprising:
- a printed circuit board sized and shaped to closely fit within the socket;
- and,
- a plurality of functional components mounted on a first surface of the printed circuit board and which are electrically coupled to the chip assembly;
- and,
- a coupling apparatus for releasably mechanically coupling the printed circuit board within the socket and electrically to the chip module.
6 more elements
Dependencies are inferred from the claim text.