Edge bead control method and apparatus
AssigneeFinisar Corporation
InventorBernard Q. Li
Life of this patent
Estimating the term…
Abstract
Methods and devices for handling wafers during wafer processing are provided. One embodiment includes an apparatus for holding a wafer. The holding apparatus includes a pocket for receiving a wafer, and may include a mechanism allowing for the wafer to be secured within the pocket. Methods are also included for preparing a wafer for fabrication processes by the use of a wafer holding apparatus. These methods may include applying a layer of photoresist to the surface of a wafer.
Claims17
A method of preparing a wafer for a fabrication process, the method comprising:
- providing a wafer receiving apparatus for receiving a wafer of a first size, the wafer receiving apparatus including a recessed portion having a depth;
- placing a wafer of the first size in the recessed portion of the wafer receiving apparatus;
- applying photoresist to the wafer;
- spinning the wafer and the wafer receiving apparatus while the wafer is placed in the recessed portion of the wafer receiving apparatus;
- and
- wherein the wafer receiving apparatus further includes a circumferential groove in the recessed portion, wherein the method further comprises:
- allowing a fluid to enter the circumferential groove;
- and
- causing the fluid in the circumferential groove to expand and release the wafer from the pocket.
A method of reducing edge bead thickness while applying photoresist to a wafer comprising:
- providing a wafer receiving apparatus for receiving a wafer of a first size, the wafer receiving apparatus including a pocket having a depth, wherein the depth is chosen to correspond to a wafer of the first size;
- placing a wafer of the first size in the pocket of the wafer receiving apparatus;
- applying photoresist to the wafer;
- spinning the wafer and the wafer receiving apparatus while the wafer is placed in the pocket to create a photoresist layer of a desired thickness;
- and
- wherein the wafer receiving apparatus is sized to be compatible with machines adapted for use with wafers of a second size larger than the first size.
A method of reducing edge bead thickness while applying photoresist to a wafer comprising:
- providing a wafer receiving apparatus for receiving a wafer of a first size, the wafer receiving apparatus including a pocket having a depth, wherein the depth is chosen to correspond to a wafer of the first size;
- placing a wafer of the first size in the pocket of the wafer receiving apparatus;
- applying photoresist to the wafer;
- spinning the wafer and the wafer receiving apparatus while the wafer is placed in the pocket to create a photoresist layer of a desired thickness;
- and
- wherein the depth is less than the thickness of the wafer plus the thickness of the desired photoresist layer.
A method of reducing edge bead thickness while applying photoresist to a wafer comprising:
- providing a wafer receiving apparatus for receiving a wafer, the wafer receiving apparatus being sized to be compatible with machines adapted for use with wafers of a second size larger than wafers of a first size, the wafer receiving apparatus including a pocket having a depth, wherein the depth is chosen to correspond to a wafer of the first size;
- placing a wafer of the first size in the pocket of the wafer receiving apparatus;
- applying photoresist to the wafer;
- spinning the wafer and the wafer receiving apparatus while the wafer is placed in the pocket to create a photoresist layer of a desired thickness;
- and
- wherein the first size is the size of a three inch wafer, and the second size is the size of a four inch wafer.
A method of reducing edge bead thickness while applying photoresist to a wafer comprising:
- providing a wafer receiving apparatus for receiving a wafer of a first size, the wafer receiving apparatus including a pocket having a depth, wherein the depth is chosen to correspond to a wafer of the first size;
- placing a wafer of the first size in the pocket of the wafer receiving apparatus;
- applying photoresist to the wafer;
- spinning the wafer and the wafer receiving apparatus while the wafer is placed in the pocket to create a photoresist layer of a desired thickness;
- and
- wherein the wafer receiving apparatus further includes a circumferential groove in the recessed portion, wherein the method further comprises:
- allowing a fluid to enter the circumferential groove;
- and
- causing the fluid in the circumferential groove to expand and release the wafer from the pocket.
Dependencies are inferred from the claim text.