Vacuum plate having a symmetrical air-load block

A vacuum plate for a fabricating apparatus of a semiconductor device, the vacuum plate comprising:

• a first vacuum panel having a plurality of exhaust boles, the plurality of exhaust holes having same area and same distance from a center of the first vacuum panel, the plurality of exhaust holes being symmetrical and spaced apart from each other;
• a second vacuum panel having a pumping hole;
• and
• a sidewall and an air-load block, the sidewall extending vertically along an edge of the second vacuum panel, the air-load block extending vertically and symmetrically, a bottom surface of the first vacuum panel contacting a top surface of the sidewall and a top surface of the air-load block, wherein the first and second vacuum panels form a plurality of concave portions coupling between the exhaust holes and the pumping hole, and wherein the concave portions have a same size;
• wherein the air-load block has first and second concave portions of same size, wherein the first concave portion encompasses exclusively a first and second of the plurality of exhaust holes and the second concave portion encompasses exclusively a third and fourth of the plurality of exhaust holes.

A fabricating apparatus of a semiconductor device, the apparatus comprising:

• a chamber of single substrate type having a susceptor and a vacuum plate therein;
• a gas supplying unit providing reaction gases to the chamber;
• and an environmental control unit exhausting the chamber, wherein the vacuum plate comprises:
• a first vacuum panel having a plurality of exhaust holes, the plurality of exhaust holes having same area and same distance from a center of the first vacuum panel, the plurality of exhaust holes being symmetrical and spaced apart from each other;
• a second vacuum panel having a pumping hole;
• and a sidewall and an air-load block, the sidewall extending vertically along an edge of the second vacuum panel, the air-load block extending vertically and symmetrically, a bottom surface of the first vacuum panel contacting a top surface of the sidewall and a top surface of the air-load block, wherein the first and second vacuum panels form first and second concave portions coupling between the exhaust holes and the pumping hole, and wherein the concave portions have a same size;
• wherein the plurality of exhaust holes comprises a plurality of first exhaust holes and a plurality of second exhaust holes, wherein the first concave portion encompasses exclusively the plurality of first exhaust holes and the second concave portion encompasses exclusively the plurality of second exhaust holes.

A vacuum plate for a fabricating apparatus of a semiconductor device, the vacuum plate comprising:

• a first vacuum panel having a plurality of exhaust holes;
• a second vacuum panel having a pumping hole;
• a sidewall extending vertically along an edge of the second vacuum panel, a top surface of the sidewall contacting a bottom surface of the first vacuum panel;
• and
• an air-load block extending vertically from the second vacuum panel and having a perimeter, a top surface of the air-load block contacting a bottom surface of the first vacuum panel, the air-load block further including first and second concave portions divided by a shielding wall that contacts the first and second vacuum panels inside the perimeter of the air-load block;
• and
• wherein the plurality of exhaust holes comprises a plurality of first exhaust holes and a plurality of second exhaust holes, wherein the first concave portion encompasses exclusively the plurality of first exhaust holes and the second concave portion encompasses exclusively the plurality of second exhaust holes.