Design driven inspection or measurement for semiconductor using recipe

For an instrument instructed by a recipe to perform a task on a wafer, a method comprising:

• receiving design data describing a die;
• extracting parameters from the design data relevant to the configuration of the instrument;
• and
• creating from the extracted parameters, the recipe for performing the task, wherein the recipe is created before a wafer to which the design data has been applied is generated.

A recipe extraction system using design data specifying one or more die, the system comprising:

• an access module to access the design data describing a die;
• an analyzer to extract parameters from the design data;
• and
• a configuration module to produce a recipe for controlling one of an inspection and a metrology instrument, wherein the configuration module produces the recipe before a wafer to which the design data has been applied is generated.

An inspection/metrology instrument using design data specifying one or more die, the instrument comprising:

• an input interface for accessing the design data describing a die;
• an analyzer to recognize target structures in the design data and extract parameters from the design data;
• and
• a recipe module creating a recipe based on the extracted parameters responsive to the recognized target structure, wherein the recipe module creates the recipe before a wafer to which the design data has been applied is generated.