Coating film forming method and apparatus

A coating-film forming apparatus comprising:

• a rotary mechanism configured to rotate a wafer while holding the wafer horizontally;
• a nozzle provided above the wafer and configured to travel over the wafer from a wafer center to a wafer outer area to spirally spray a coating solution on the wafer;
• and
• a controller configured to control the nozzle to stop when the coating solution has reached the wafer outer area, and to spray the coating solution in a circle on the wafer outer area while the wafer is rotating and to gradually increase a peripheral velocity of the wafer under the nozzle to gradually narrow a width of the coating solution sprayed on the wafer as the coating solution approaches a final coating point on the wafer.

A coating-film forming apparatus comprising:

• a rotary mechanism configured to rotate a wafer while holding the wafer horizontally;
• a nozzle provided above the wafer and configured to travel over the wafer from a wafer center to a wafer outer area to spirally spray a coating solution on the wafer;
• and
• a controller configured to control the nozzle to stop when the coating solution has reached the wafer outer area, and to spray the coating solution in a circle on the wafer outer area while the wafer is rotating and to gradually decrease an amount of the coating solution sprayed and to gradually increase a peripheral velocity of the wafer under the nozzle to gradually narrow a width of the coating solution sprayed on the wafer as the coating solution approaches a final coating point on the wafer.