Low cost package design for fiber coupled optical component
AssigneeMatsushita Electric Industrial Co., Ltd.
InventorMichael Powers
Life of this patent
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Abstract
A fiber-coupled optical component package comprises a high thermal conductivity base, a housing including a ceramic substrate, an optical component mount aperture formed on the substrate and a substantially planar fiber mount region on the substrate adjacent to the optical component mount aperture. An optical component may be secured within an area defined by the optical component mount aperture and an optical fiber may be secured to the substantially planar fiber mount region to optically couple the fiber and the optical component. A package lid may be placed over one or more of the housing, the optical component, and a portion of the fiber.
Claims25
A fiber-coupled optical component housing comprising a substrate having an optical component mount aperture formed therein and a substantially planar fiber mount region adjacent to the optical component mount aperture, wherein the fiber mount is configured to mount the optical fiber directly to the substrate.
A fiber-coupled optical component housing comprising:
- a substrate having an optical component mount aperture formed therein and a substantially planar fiber mount region adjacent to the optical component mount aperture;
- and
- a metallic fiber mount pad formed on the substantially planar fiber mount region the metallic fiber mount pad being configured to secure the optical fiber to the substrate with a metallic solder.
A fiber-coupled optical component package comprising:
- a high thermal conductivity base;
- a fiber-coupled optical component housing joined to a surface of the base and including:
- a substrate having an optical component mount aperture formed therein and a substantially planar fiber mount region adjacent to the optical component mount aperture, wherein the fiber mount region is configured to mount the optical fiber directly to the substrate, and
- means for mounting a lid on the housing.
A method for forming a fiber-coupled optical component package, comprising the steps of:
- a) providing a package base having a high thermal conductivity;
- b) forming a ceramic housing having an optical component mount aperture;
- c) securing the ceramic housing to the base;
- and
- d) designating a substantially planar fiber mount region on a surface of the ceramic housing adjacent to the optical component mount aperture for mounting an optical fiber directly on the ceramic housing.
A method for forming a fiber-coupled optical component package, comprising the steps of:
- a) providing a package base having a high thermal conductivity;
- b) forming a ceramic housing having an optical component mount aperture;
- c) securing the ceramic housing to the base;
- d) designating a substantially planar fiber mount region on a surface of the ceramic housing adjacent to the optical component mount aperture;
- e) forming a metallic fiber mount pad on the substantially planar fiber mount region
- f) securing an optical component to the base within an area defined by the optical component mountable aperture;
- g) securing an optical fiber to the metallic fiber mount pad using a metallic solder to optically couple the fiber and an output coupler of the optical component.
Dependencies are inferred from the claim text.