Heat sink for convection cooling in horizontal applications

A heat sink for convection cooling in horizontal applications, comprising:

• a plurality of spaced apart cooling fins, wherein each cooling fin has a center portion and opposing outer portions, and wherein the opposing outer portions of the plurality of spaced apart cooling fins are tapered;
• an angled base supporting the center portions of the cooling fins, wherein the outer portions of the cooling fins extend beyond an outer edge of the base so that air can flow horizontally beneath the base and then vertically through the spaced apart cooling fins;
• and
• wherein the cooling fins are transversely attached to the base and extend from the base in a substantially vertical direction, and wherein the angled base comprises a central region for receiving a surface to be cooled and opposing end regions adjacent the central region.

A heat sink for convection cooling in horizontal applications, comprising:

• a plurality of spaced apart cooling fins, wherein each cooling fin has a center portion and opposing outer portions;
• a base supporting the center portions of the cooling fins, wherein the base comprises a central region for receiving a surface to be cooled and opposing end regions adjacent the central region, and wherein a bottom surface of each end region is angled with respect to the central region;
• and
• wherein the outer portions of the cooling fins extend beyond an outer edge of the base so that air can flow horizontally beneath the base and then vertically through the spaced apart cooling fins, and wherein the outer portions of the plurality of spaced apart cooling fins and the opposing end regions of the base are tapered.

A heat sink for convection cooling of microelectronic devices, comprising:

• a plurality of spaced apart cooling fins, wherein each cooling fin has a center portion and opposing outer portions;
• an angled base supporting the center portions of the cooling fins, wherein the base comprises a central region for receiving a surface to be cooled and opposing end regions extending from the central region, wherein the central region has a greater width than the end regions;
• and
• wherein the outer portions of the cooling fins extend beyond an outer edge of the base so that air can flow horizontally beneath the base and then vertically through the spaced apart cooling fins, and wherein opposing outer portions of the plurality of spaced apart cooling fins are tapered.

A heat sink for convection cooling in horizontal applications, comprising:

• a plurality of spaced apart cooling fins, wherein each cooling fin has a center portion and opposing outer portions;
• a base supporting the center portions of the cooling fins, wherein the base includes a central region for receiving a surface to be cooled and opposing end regions adjacent the central region, wherein the central region has a greater width than the end regions, and wherein a bottom surface of each end region is angled with respect to the central region;
• and
• wherein the outer portions of the cooling fins extend beyond an outer edge of the base so that air can flow horizontally beneath the base and then vertically through the spaced apart fins, wherein the cooling fins are transversely attached on the base and extend in a substantially vertical direction, and wherein the opposing end regions of the base are tapered.

A heat sink for convection cooling in horizontal applications, comprising:

• a plurality of spaced apart cooling fins, wherein each cooling fin has a center portion and opposing outer portions;
• an angled base supporting the center portions of the cooling fins, wherein the outer portions of the cooling fins extend beyond an outer edge of the base so that air can flow horizontally beneath the base and then vertically through the spaced apart cooling fins;
• and
• wherein the angled base comprises a central region for receiving a surface to be cooled and opposing end regions adjacent the base, and wherein the opposing end regions are tapered.

A heat sink for convection cooling in horizontal applications, comprising:

• a plurality of spaced apart cooling fins, wherein each cooling fin has a center portion and opposing outer portions;
• a base supporting the center portions of the cooling fins, wherein the base comprises a central region for receiving a surface to be cooled and tapered opposing end regions adjacent the central region, and wherein a bottom surface of each end region is angled with respect to the central region;
• and
• wherein the outer portions of the cooling fins are tapered and extend beyond an outer edge of the base so that air can flow horizontally beneath the base and then vertically through the spaced apart cooling fins, and wherein the cooling fins are transversely attached to the base and extend from the base in a substantially vertical direction.

A heat sink for convection cooling of microelectronic devices, comprising:

• a plurality of spaced apart cooling fins, wherein each cooling fin has a center portion and opposing outer portions;
• an angled base supporting the center portions of the cooling fins, wherein the base comprises a central region for receiving a surface to be cooled and tapered opposing end regions adjacent the central region, wherein the central region has a greater width than the end regions;
• and
• wherein the outer portions of the cooling fins are tapered and extend beyond an outer edge of the base so that air can flow horizontally beneath the base and then vertically through the spaced apart cooling fins, and wherein the cooling fins are transversely attached to the base and extend in a substantially vertical direction.