Semiconductor manufacturing facility and a semiconductor manufacturing method

A semiconductor manufacturing facility including an apparatus having a vibration source, comprising:

• an installation table having a rigid structure on which the apparatus having a vibration source is installed;
• and
• a floor construction on which said installation table is installed,
• wherein said floor construction includes a floor member extending in a horizontal direction and a plurality of columns supporting the floor member, and said floor member has an accelerance calculated by:
• converting an allowable vibration value expressed in acceleration of said apparatus into a ⅓ octave-band peak hold analysis rms value;
• performing a frequency analysis on a vibration-force time history waveform obtained from said apparatus so as to calculate a ⅓ octave-band vibration force expressed in ⅓ octave-band peak hold analysis rms value;
• calculating a necessary accelerance ACCLnec by dividing the allowable vibration value by the vibration force obtained by performing the frequency analysis in a range of observed frequencies;
• setting a safety factor k to a value in a range of 2 to 7 in accordance with a number of vibration sources around said apparatus and magnitude of vibrations from the vibration sources so as to eliminate influences of vibrations transmitting from the vibration sources;
• setting a set accelerance ACCLest by dividing said necessary accelerance ACCLnec by the safety factor k;
• and
• determining an accelerance to be used for construction design that covers any value of said necessary accelerance ACCLnec that varies with frequencies of vibration from said apparatus.